XC2VP7-6FF672C

The XC2VP7-6FF672C is a Virtex®-II Pro field programmable gate array (FPGA) supplied in a 672-ball FCBGA package (27×27). It delivers a balanced mix of logic, embedded memory, and high-density I/O for commercial embedded and system applications.

As a member of the Virtex‑II Pro platform, the family provides a documented FPGA architecture with configurable logic blocks, dedicated multiplier and RAM resources, and support for advanced I/O and embedded processor/transceiver building blocks referenced in the platform specification.

Key Features

• Logic Capacity — 11,088 logic elements and 1,232 configurable logic blocks (CLBs) to implement complex combinational and sequential logic.
• Embedded Memory — Approximately 0.81 Mbits of total on-chip RAM for buffering, FIFOs, and embedded data storage.
• High-Density I/O — 396 I/O pins to support extensive external interfacing and board-level connectivity.
• Package — 672-ball FCBGA (27×27) surface-mount package for high pin-count, compact board integration.
• Power and Thermal — Core supply voltage range from 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
• Mounting and Compliance — Surface-mount device with RoHS compliance for lead-free assembly processes.
• Platform Capabilities — Virtex‑II Pro family features documented in the platform specification include integrated processor block options, multi-gigabit transceiver architecture, dedicated 18×18 multipliers, digital clock management, and SelectRAM™ memory hierarchy (feature availability varies by device within the family).

Typical Applications

• Embedded System Integration — Implement custom control and data-path logic where moderate logic density and embedded memory are required.
• High‑I/O Interface Boards — Drive complex front‑end or backplane interfacing using the device's 396 I/Os in compact FCBGA form factors.
• Signal Processing — Use on-chip RAM and dedicated multiplier resources (available across the Virtex‑II Pro family) for buffering and arithmetic tasks in digital signal processing pipelines.
• Prototyping and Platform Development — Leverage the Virtex‑II Pro platform specification for designs that may integrate processor cores or multi-gigabit transceivers within the family architecture.

Unique Advantages

• Balanced Logic and Memory: 11,088 logic elements paired with approximately 0.81 Mbits of embedded RAM enable mid-range FPGA designs without external memory for many functions.
• Extensive I/O Count: 396 I/Os support complex peripheral and system interconnect requirements, minimizing the need for additional interface chips.
• Compact High‑Pin Package: 672‑ball FCBGA (27×27) provides high pin density for board designs constrained by PCB area while maintaining robust signal routing.
• Commercial‑Grade Operation: Rated for 0 °C to 85 °C with a defined core supply range, suitable for mainstream commercial embedded applications.
• RoHS Compliant: Meets lead‑free assembly requirements for contemporary manufacturing processes.
• Documented Platform Architecture: Supported by comprehensive Virtex‑II Pro platform documentation detailing CLBs, block RAM, multipliers, clocking, and transceiver/processor block options across the family.

Why Choose XC2VP7-6FF672C?

The XC2VP7-6FF672C positions itself as a practical Virtex‑II Pro platform device for designers who need a reliable balance of logic density, embedded memory, and a high number of I/Os in a compact FCBGA package. Its defined power and temperature specifications, along with RoHS compliance, make it suitable for commercial embedded applications where documented platform capabilities and on-chip resources matter.

Choose this device when your design requires mid-range FPGA resources, substantial I/O, and integration options aligned with the Virtex‑II Pro family architecture and documentation.

Request a quote or submit a product inquiry today to evaluate the XC2VP7-6FF672C for your next design.