XC2VP7-6FFG672C
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 396 811008 11088 672-BBGA, FCBGA |
|---|---|
| Quantity | 648 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 396 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 1232 | Number of Logic Elements/Cells | 11088 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 811008 |
Overview of XC2VP7-6FFG672C – Virtex®-II Pro Field Programmable Gate Array (FPGA) IC
The XC2VP7-6FFG672C is a Virtex®-II Pro series FPGA in a 672-ball FCBGA package, designed for commercial embedded logic applications. This device delivers a balanced mix of programmable logic capacity, on-chip memory, and high I/O density for system designs requiring flexible hardware acceleration, protocol bridging, or custom peripheral integration.
As a member of the Virtex-II Pro family, the platform includes series-level capabilities such as embedded PowerPC processor blocks and RocketIO multi‑gigabit transceivers (refer to the Virtex‑II Pro product documentation for device-specific availability and configuration). The part is RoHS compliant and supplied in a surface-mount 672-FCBGA (27×27) package for compact board-level integration.
Key Features
- Logic Capacity Approximately 11,088 logic elements, enabling medium-complexity custom logic implementations and hardware acceleration tasks.
- Embedded Memory Approximately 0.81 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
- I/O Density 396 user I/O pins for interfacing a wide range of external peripherals, buses, and high-speed interfaces.
- Package 672-BBGA (FCBGA) 27×27 mm supplier device package for high-density, surface-mount applications.
- Power Supply Core supply voltage range of 1.425 V to 1.575 V, enabling deterministic power design for the FPGA core.
- Operating Range Commercial temperature grade with operating range 0 °C to 85 °C suitable for standard electronics environments.
- Mounting and Compliance Surface mount device with RoHS compliance for environmental regulatory alignment.
- Series-Level Platform Capabilities Virtex‑II Pro family features include embedded PowerPC™ 405 processor blocks and RocketIO multi‑gigabit transceivers; consult the family datasheet for applicable modules and configurations.
Typical Applications
- Telecommunications & Datacom High I/O density and family-level RocketIO transceiver support make this device suitable for protocol bridging, packet processing, and network interface logic.
- Embedded Processing Systems Device-level resources and Virtex‑II Pro platform processor blocks (family-level) support on-chip control, custom accelerators, and soft/hard processor integration.
- Custom Hardware Acceleration Approximately 11,088 logic elements and embedded memory enable offloading compute kernels and real-time data path implementations.
- High-Density I/O Control With 396 I/O pins in a compact 27×27 FCBGA package, the device is well-suited for board designs that require numerous external interfaces in a small footprint.
Unique Advantages
- Balanced integration: Combines substantial logic resources with on-chip RAM and high I/O count to reduce external component requirements.
- Compact package: 672-FCBGA (27×27) delivers high pin count in a space-efficient surface-mount form factor.
- Design predictability: Defined core supply range and commercial temperature rating simplify power budgeting and thermal planning.
- Platform support: Virtex‑II Pro family documentation provides IP core and reference support for system-level integration and development.
- Regulatory alignment: RoHS compliance supports environmental directives and manufacturing requirements.
Why Choose XC2VP7-6FFG672C?
The XC2VP7-6FFG672C positions itself as a versatile Virtex‑II Pro FPGA option for teams that need a mid-range programmable-logic device with substantial I/O and embedded memory in a compact FCBGA package. Its device-level specifications—approximately 11,088 logic elements, ~0.81 Mbits of embedded RAM, 396 I/Os, and a tightly specified core voltage—make it a practical choice for developed embedded systems, protocol-processing modules, and custom hardware accelerators in commercial environments.
Designers benefit from the Virtex‑II Pro platform documentation and family-level features when integrating processor blocks or high-speed transceivers where supported, while RoHS compliance and surface-mount packaging streamline manufacturing and assembly workflows.
Request a quote or submit an inquiry to get pricing, availability, and package options for XC2VP7-6FFG672C. Our team can provide ordering details and support material to help you evaluate this FPGA for your design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








