XC2VP7-6FFG672C

IC FPGA 396 I/O 672FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 396 811008 11088 672-BBGA, FCBGA

Quantity 648 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O396Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1232Number of Logic Elements/Cells11088
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits811008

Overview of XC2VP7-6FFG672C – Virtex®-II Pro Field Programmable Gate Array (FPGA) IC

The XC2VP7-6FFG672C is a Virtex®-II Pro series FPGA in a 672-ball FCBGA package, designed for commercial embedded logic applications. This device delivers a balanced mix of programmable logic capacity, on-chip memory, and high I/O density for system designs requiring flexible hardware acceleration, protocol bridging, or custom peripheral integration.

As a member of the Virtex-II Pro family, the platform includes series-level capabilities such as embedded PowerPC processor blocks and RocketIO multi‑gigabit transceivers (refer to the Virtex‑II Pro product documentation for device-specific availability and configuration). The part is RoHS compliant and supplied in a surface-mount 672-FCBGA (27×27) package for compact board-level integration.

Key Features

  • Logic Capacity  Approximately 11,088 logic elements, enabling medium-complexity custom logic implementations and hardware acceleration tasks.
  • Embedded Memory  Approximately 0.81 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
  • I/O Density  396 user I/O pins for interfacing a wide range of external peripherals, buses, and high-speed interfaces.
  • Package  672-BBGA (FCBGA) 27×27 mm supplier device package for high-density, surface-mount applications.
  • Power Supply  Core supply voltage range of 1.425 V to 1.575 V, enabling deterministic power design for the FPGA core.
  • Operating Range  Commercial temperature grade with operating range 0 °C to 85 °C suitable for standard electronics environments.
  • Mounting and Compliance  Surface mount device with RoHS compliance for environmental regulatory alignment.
  • Series-Level Platform Capabilities  Virtex‑II Pro family features include embedded PowerPC™ 405 processor blocks and RocketIO multi‑gigabit transceivers; consult the family datasheet for applicable modules and configurations.

Typical Applications

  • Telecommunications & Datacom  High I/O density and family-level RocketIO transceiver support make this device suitable for protocol bridging, packet processing, and network interface logic.
  • Embedded Processing Systems  Device-level resources and Virtex‑II Pro platform processor blocks (family-level) support on-chip control, custom accelerators, and soft/hard processor integration.
  • Custom Hardware Acceleration  Approximately 11,088 logic elements and embedded memory enable offloading compute kernels and real-time data path implementations.
  • High-Density I/O Control  With 396 I/O pins in a compact 27×27 FCBGA package, the device is well-suited for board designs that require numerous external interfaces in a small footprint.

Unique Advantages

  • Balanced integration: Combines substantial logic resources with on-chip RAM and high I/O count to reduce external component requirements.
  • Compact package: 672-FCBGA (27×27) delivers high pin count in a space-efficient surface-mount form factor.
  • Design predictability: Defined core supply range and commercial temperature rating simplify power budgeting and thermal planning.
  • Platform support: Virtex‑II Pro family documentation provides IP core and reference support for system-level integration and development.
  • Regulatory alignment: RoHS compliance supports environmental directives and manufacturing requirements.

Why Choose XC2VP7-6FFG672C?

The XC2VP7-6FFG672C positions itself as a versatile Virtex‑II Pro FPGA option for teams that need a mid-range programmable-logic device with substantial I/O and embedded memory in a compact FCBGA package. Its device-level specifications—approximately 11,088 logic elements, ~0.81 Mbits of embedded RAM, 396 I/Os, and a tightly specified core voltage—make it a practical choice for developed embedded systems, protocol-processing modules, and custom hardware accelerators in commercial environments.

Designers benefit from the Virtex‑II Pro platform documentation and family-level features when integrating processor blocks or high-speed transceivers where supported, while RoHS compliance and surface-mount packaging streamline manufacturing and assembly workflows.

Request a quote or submit an inquiry to get pricing, availability, and package options for XC2VP7-6FFG672C. Our team can provide ordering details and support material to help you evaluate this FPGA for your design.

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