XC2VP7-6FG456I

IC FPGA 248 I/O 456FBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 248 811008 11088 456-BBGA

Quantity 1,037 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case456-BBGANumber of I/O248Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1232Number of Logic Elements/Cells11088
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits811008

Overview of XC2VP7-6FG456I – Virtex®-II Pro Field Programmable Gate Array, 248 I/O, ~0.811 Mbits RAM, 11088 logic elements, 456-BBGA

The XC2VP7-6FG456I is a Virtex®-II Pro family FPGA supplied in a 456-BBGA package (supplier device package: 456-FBGA, 23×23). It combines programmable logic, on-chip memory, and a broad I/O complement to support embedded processing and high-speed serial communication applications.

Designed for industrial environments, this device provides a defined operating voltage range and extended temperature capability, making it suitable for systems that require robust electrical and thermal performance.

Key Features

  • Logic Resources  Approximately 11,088 logic elements (cells) and 1,232 configurable logic blocks (CLBs) for implementing complex digital logic.
  • Embedded Memory  Approximately 0.811 Mbits of on-chip RAM (811,008 total bits) to support buffering, lookup tables, and embedded data storage.
  • I/O Density  Up to 248 user I/O pins to connect to peripherals, interfaces, and system buses.
  • Virtex-II Pro Family Capabilities  Family-level features include support for RocketIO™ multi-gigabit transceivers, up to two embedded PowerPC™ RISC processor blocks, dedicated 18-bit × 18-bit multiplier blocks, digital clock management (DCM), and SelectRAM™+ memory hierarchy.
  • Digitally Controlled I/O  SelectI/O™-Ultra technology and XCITE Digitally Controlled Impedance (DCI) I/O options are part of the Virtex-II Pro platform feature set.
  • Package & Mounting  456-BBGA package, supplied as a 456-FBGA (23×23), designed for surface-mount assembly.
  • Power  Specified core voltage supply range: 1.425 V to 1.575 V.
  • Industrial Temperature Rating  Operating temperature range: −40 °C to 100 °C.
  • RoHS Compliant  Device is RoHS compliant.

Typical Applications

  • Embedded Processing Systems  Leverage the Virtex-II Pro family’s support for embedded PowerPC™ processor blocks and programmable logic to implement tightly integrated processor+FPGA solutions.
  • High-Speed Communications  Use RocketIO™ multi-gigabit transceiver support (family feature) and high I/O density to implement serial links and protocol interfaces in networking and telecom equipment.
  • Signal Processing & Acceleration  Dedicated multiplier blocks and significant on-chip RAM make the device suitable for hardware-accelerated signal processing and data-path implementations.
  • Industrial Control  Industrial temperature rating and robust I/O count support control systems, machine interfaces, and factory automation applications.

Unique Advantages

  • Integrated processor and FPGA functionality: Family-level support for embedded PowerPC™ cores enables consolidated system architectures with programmable acceleration and control.
  • High logic and memory density in a compact package: 11,088 logic elements and ~0.811 Mbits of embedded memory deliver substantial on-chip resources within a 456-BBGA footprint.
  • Flexible I/O and serial interface options: 248 I/O pins combined with Virtex-II Pro transceiver features provide design flexibility for diverse interface requirements.
  • Industrial operating range: −40 °C to 100 °C rating supports deployment in a wide range of environmental conditions.
  • Controlled power envelope: Narrow core supply specification (1.425 V to 1.575 V) simplifies power rail design and margining.
  • Standards-conscious manufacturing: RoHS compliance aligns the device with common environmental and manufacturing requirements.

Why Choose XC2VP7-6FG456I?

The XC2VP7-6FG456I brings Virtex®-II Pro family capabilities into a compact, industrial-temperature FPGA package with a balance of logic, memory, and I/O resources. It is suited to designs that need embedded processing support, significant on-chip memory, and high I/O density while operating across an extended temperature range.

For engineering teams focused on system consolidation, performance-oriented I/O, and reliability in industrial settings, this device offers an established platform of programmable resources and family-level features to accelerate development and deployment.

Request a quote or submit an inquiry to receive pricing and availability for the XC2VP7-6FG456I. Our team can provide lead-time details and support your procurement questions.

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