XC2VP7-6FG456I
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 248 811008 11088 456-BBGA |
|---|---|
| Quantity | 1,037 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 248 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1232 | Number of Logic Elements/Cells | 11088 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 811008 |
Overview of XC2VP7-6FG456I – Virtex®-II Pro Field Programmable Gate Array, 248 I/O, ~0.811 Mbits RAM, 11088 logic elements, 456-BBGA
The XC2VP7-6FG456I is a Virtex®-II Pro family FPGA supplied in a 456-BBGA package (supplier device package: 456-FBGA, 23×23). It combines programmable logic, on-chip memory, and a broad I/O complement to support embedded processing and high-speed serial communication applications.
Designed for industrial environments, this device provides a defined operating voltage range and extended temperature capability, making it suitable for systems that require robust electrical and thermal performance.
Key Features
- Logic Resources Approximately 11,088 logic elements (cells) and 1,232 configurable logic blocks (CLBs) for implementing complex digital logic.
- Embedded Memory Approximately 0.811 Mbits of on-chip RAM (811,008 total bits) to support buffering, lookup tables, and embedded data storage.
- I/O Density Up to 248 user I/O pins to connect to peripherals, interfaces, and system buses.
- Virtex-II Pro Family Capabilities Family-level features include support for RocketIO™ multi-gigabit transceivers, up to two embedded PowerPC™ RISC processor blocks, dedicated 18-bit × 18-bit multiplier blocks, digital clock management (DCM), and SelectRAM™+ memory hierarchy.
- Digitally Controlled I/O SelectI/O™-Ultra technology and XCITE Digitally Controlled Impedance (DCI) I/O options are part of the Virtex-II Pro platform feature set.
- Package & Mounting 456-BBGA package, supplied as a 456-FBGA (23×23), designed for surface-mount assembly.
- Power Specified core voltage supply range: 1.425 V to 1.575 V.
- Industrial Temperature Rating Operating temperature range: −40 °C to 100 °C.
- RoHS Compliant Device is RoHS compliant.
Typical Applications
- Embedded Processing Systems Leverage the Virtex-II Pro family’s support for embedded PowerPC™ processor blocks and programmable logic to implement tightly integrated processor+FPGA solutions.
- High-Speed Communications Use RocketIO™ multi-gigabit transceiver support (family feature) and high I/O density to implement serial links and protocol interfaces in networking and telecom equipment.
- Signal Processing & Acceleration Dedicated multiplier blocks and significant on-chip RAM make the device suitable for hardware-accelerated signal processing and data-path implementations.
- Industrial Control Industrial temperature rating and robust I/O count support control systems, machine interfaces, and factory automation applications.
Unique Advantages
- Integrated processor and FPGA functionality: Family-level support for embedded PowerPC™ cores enables consolidated system architectures with programmable acceleration and control.
- High logic and memory density in a compact package: 11,088 logic elements and ~0.811 Mbits of embedded memory deliver substantial on-chip resources within a 456-BBGA footprint.
- Flexible I/O and serial interface options: 248 I/O pins combined with Virtex-II Pro transceiver features provide design flexibility for diverse interface requirements.
- Industrial operating range: −40 °C to 100 °C rating supports deployment in a wide range of environmental conditions.
- Controlled power envelope: Narrow core supply specification (1.425 V to 1.575 V) simplifies power rail design and margining.
- Standards-conscious manufacturing: RoHS compliance aligns the device with common environmental and manufacturing requirements.
Why Choose XC2VP7-6FG456I?
The XC2VP7-6FG456I brings Virtex®-II Pro family capabilities into a compact, industrial-temperature FPGA package with a balance of logic, memory, and I/O resources. It is suited to designs that need embedded processing support, significant on-chip memory, and high I/O density while operating across an extended temperature range.
For engineering teams focused on system consolidation, performance-oriented I/O, and reliability in industrial settings, this device offers an established platform of programmable resources and family-level features to accelerate development and deployment.
Request a quote or submit an inquiry to receive pricing and availability for the XC2VP7-6FG456I. Our team can provide lead-time details and support your procurement questions.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








