XC2VP7-7FF672C

The XC2VP7-7FF672C is a commercial-grade Virtex®-II Pro field programmable gate array supplied in a 672-ball flip-chip BGA (672-FCBGA, 27×27) package. It provides a balanced platform of logic capacity, embedded memory, and high I/O density for system-level integration in communications, embedded processing, and signal-processing designs.

Built on the Virtex-II Pro platform architecture, the device combines flexible logic resources and on-chip memory with platform-level features described in the Virtex-II Pro family specification, delivering a programmable foundation for designs that require moderate logic density, substantial I/O, and controlled supply/temperature ranges.

Key Features

• Logic Capacity — 11,088 logic elements to implement custom logic, control functions, and system glue logic.
• Embedded Memory — Approximately 0.81 Mbits of on-chip RAM (811,008 total RAM bits) for buffering, FIFOs, and small data stores.
• I/O Density — 396 user I/O pins to support wide parallel interfaces, multi-channel connectivity, and mixed-signal front-end interconnects.
• Platform Architecture — Built on the Virtex-II Pro platform with architecture elements such as the SelectRAM memory hierarchy and dedicated 18-bit × 18-bit multiplier blocks described in the family specification.
• Package and Mounting — 672-ball FCBGA / BBGA package (672-FCBGA, 27×27) with surface-mount assembly for high-density board designs.
• Supply and Temperature — Core voltage range 1.425 V to 1.575 V and commercial operating temperature range 0 °C to 85 °C for standard embedded applications.
• Compliance — RoHS compliant, meeting common lead-free assembly requirements.

Typical Applications

• High-speed communications: Leverage platform-level multi-gigabit transceiver and clocking features described for the Virtex-II Pro family to implement serial links and protocol bridging.
• Embedded processing and control: Use the FPGA’s logic and on-chip memory to implement control processors, offload tasks, or interface to external processor subsystems.
• Signal processing and DSP functions: Dedicated multiplier blocks and embedded RAM support fixed-point filtering, transforms, and data-path acceleration.
• I/O-rich system glue and prototyping: High I/O count and moderate logic density make the device suitable for board-level integration, interface bridging, and prototyping of complex systems.

Unique Advantages

• Balanced integration: Combines substantial logic elements with on-chip memory and a high number of I/Os, reducing the need for external glue logic and memory in many designs.
• Platform-level resources: Architecture features described for the Virtex-II Pro family (SelectRAM memory hierarchy, dedicated multipliers, advanced clock management) provide flexible building blocks for a wide range of functions.
• Compact, high-density packaging: The 672-FCBGA (27×27) package enables a high pin-count solution in a compact footprint for space-constrained PCBs.
• Commercial readiness: Commercial grade rating and RoHS compliance make the device suitable for mainstream embedded and networking applications.
• Predictable power and thermal envelope: Defined supply voltage range (1.425 V–1.575 V) and operating temperature (0 °C–85 °C) simplify power-supply and thermal budgeting during system design.

Why Choose XC2VP7-7FF672C?

The XC2VP7-7FF672C places a practical mix of programmable logic, embedded memory, and high I/O count into a single, surface-mount FCBGA package. It is well suited to designers who need medium-scale logic capacity paired with family-level FPGA architecture features for communications, embedded control, and DSP tasks, while keeping board-level complexity and external component count under control.

For engineering teams targeting commercial embedded and networking products, the XC2VP7-7FF672C offers a reliable platform with verifiable supply and thermal specifications, RoHS compliance, and the architectural advantages described in the Virtex-II Pro family datasheet.

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