XC2VP7-6FGG456C

The XC2VP7-6FGG456C is a Virtex®-II Pro platform Field Programmable Gate Array (FPGA) supplied in a 456-ball BGA package. It provides a balanced combination of programmable logic, embedded memory and I/O resources for commercial embedded and communications designs.

As a member of the Virtex-II Pro family, the device leverages the platform’s architecture to support high-performance logic, on-chip memory, and advanced I/O capabilities suitable for telecommunications, embedded processing and custom hardware acceleration tasks.

Key Features

• Logic Capacity: 1,232 CLBs and 11,088 logic elements for implementing complex, custom digital functions.
• Embedded Memory: Approximately 0.81 Mbits of on-chip RAM (811,008 total RAM bits) to support buffering, FIFOs and local storage.
• Dense I/O: 248 user I/O pins to interface with peripherals, buses and high-speed signaling requirements.
• Platform Features (Virtex-II Pro): Family-level support for embedded PowerPC processor blocks and RocketIO multi-gigabit transceivers, plus dedicated 18-bit × 18-bit multiplier blocks and SelectRAM memory hierarchy.
• Package & Mounting: 456-ball BGA (supplier package: 456-FBGA, 23×23 mm) in a surface-mount form factor for compact board integration.
• Power: Core voltage supply range 1.425 V to 1.575 V to match system power rails.
• Operating Range & Grade: Commercial grade with operating temperature 0 °C to 85 °C.
• Environmental Compliance: RoHS compliant.

Typical Applications

• Telecommunications & Networking: Use the device’s Virtex-II Pro platform I/O and RocketIO transceiver capabilities to build protocol engines and line-card logic for data and telecom equipment.
• Embedded Processing & Control: Leverage the platform’s support for embedded processor blocks alongside programmable logic to implement control planes, offload engines and system management functions.
• Custom Signal Processing: Deploy the FPGA’s logic elements, multiplier blocks and on-chip RAM for application-specific DSP, filtering and data path acceleration.

Unique Advantages

• Platform-Level Integration: Virtex-II Pro architecture combines programmable logic with embedded processor and high-speed I/O capabilities, reducing the need for discrete controllers.
• Right-Sized Logic Density: 11,088 logic elements across 1,232 CLBs provide a mid-range resource profile suitable for complex control and acceleration tasks without excessive board area.
• On-Chip Memory for Low-Latency Functions: Approximately 0.81 Mbits of embedded RAM supports tight buffering and real-time data handling inside the FPGA fabric.
• High Pin Count for System Connectivity: 248 I/O pins enable direct interfacing to a broad set of peripherals and external devices, simplifying system routing.
• Compact, Surface-Mount BGA: 456-ball FBGA (23×23 mm) package provides a compact footprint for space-constrained PCBs while maintaining robust interconnect density.
• Commercial Temperature & RoHS Compliance: Designed for commercial operating conditions (0 °C to 85 °C) and RoHS compliant for regulatory alignment.

Why Choose XC2VP7-6FGG456C?

The XC2VP7-6FGG456C positions itself as a versatile Virtex-II Pro platform FPGA that bridges programmable logic, embedded memory and high-density I/O in a compact 456-BBGA package. Its combination of 11,088 logic elements, sizeable on-chip RAM and family-level support for embedded processor blocks and high-speed transceivers makes it well suited for commercial embedded and communications applications that require integrated processing and custom hardware acceleration.

For designs that demand a balanced FPGA resource set, predictable commercial-temperature operation and RoHS compliance, this device offers a practical platform with the scalability and ecosystem benefits associated with the Virtex-II Pro family.

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