XC2VP7-6FFG672I

The XC2VP7-6FFG672I is an industrial-grade Virtex®-II Pro field programmable gate array supplied in a 672-FCBGA (27×27) package. It combines a substantial pool of logic elements and embedded memory with high-density I/O and family-level features for systems requiring on-chip processing and high-performance data handling.

Targeted at embedded systems, communications equipment and high-performance board-level designs, this device provides an integrated platform-level feature set—including support for embedded processor blocks and multi-gigabit transceiver technology—while operating across an extended industrial temperature range.

Key Features

• Logic Resources — 11,088 logic elements to implement complex digital functions and custom logic fabrics.
• Embedded Memory — Approximately 0.81 Mbits of on-chip RAM (811,008 total bits) for buffering, packet storage and local data processing.
• I/O Density — 396 user I/O pins to support wide parallel interfaces and board-level connectivity.
• Family-Level System Features — Virtex-II Pro family capabilities include support for RocketIO™ multi-gigabit transceivers and embedded processor blocks (PowerPC™ 405 core support described in family documentation).
• Dedicated DSP Primitives — 18-bit × 18-bit multiplier blocks and 18-Kb Block SelectRAM resources (family feature) for signal processing and arithmetic-heavy functions.
• Package & Mounting — 672-FCBGA (27×27) supplier device package, surface-mount mounting type for high-density PCB assembly.
• Power — Core supply range 1.425 V to 1.575 V to match system power rail planning.
• Environmental & Grade — Industrial grade device, RoHS compliant, with an operating temperature range of −40 °C to 100 °C for extended-temperature applications.

Typical Applications

• Telecommunications and Datacom — Use the device’s family-level multi-gigabit transceiver support and high I/O count for board designs handling high-speed serial/parallel data streams.
• Embedded Processing Platforms — Leverage the Virtex-II Pro family’s support for embedded processor blocks and rich logic/memory resources for system-on-chip applications and control tasks.
• Signal Processing — Dedicated multiplier blocks and on-chip RAM make the device suitable for FPGA-based filtering, DSP front-ends and real-time arithmetic workloads.
• High-Density Board Designs — 672-FCBGA packaging and 396 I/Os enable compact assemblies where board area and dense connectivity are critical.

Unique Advantages

• Balanced Logic and Memory — 11,088 logic elements combined with approximately 0.81 Mbits of embedded RAM support complex state machines and local data buffering without external memory in many designs.
• High I/O Connectivity — 396 I/Os simplify integration with parallel buses, wide data paths and diverse peripheral sets.
• Industrial-Ready Thermal Range — Rated for −40 °C to 100 °C operation to meet extended-temperature deployment requirements.
• Packaged for High-Density Boards — 672-FCBGA (27×27) package provides a compact, surface-mount footprint for dense PCB implementations.
• Regulatory Compliance — RoHS compliance supports regulatory and manufacturing readiness for lead-free production processes.

Why Choose XC2VP7-6FFG672I?

The XC2VP7-6FFG672I delivers a practical blend of logic capacity, embedded memory and I/O density in an industrial-temperature, RoHS-compliant FCBGA package. As part of the Virtex®-II Pro family, it offers platform-level capabilities—such as on-chip processor block support and multi-gigabit transceiver technology—that simplify system architectures requiring embedded processing and high-throughput data handling.

This device is well suited to engineers developing communications equipment, embedded compute modules and DSP-centric applications who require a robust, board-friendly FPGA with verified family-level features and clear electrical and thermal operating parameters.

Request a quote or submit an inquiry to check availability and pricing for the XC2VP7-6FFG672I and to discuss how it fits your design requirements.