XC2VP7-6FG456C

The XC2VP7-6FG456C is an AMD Virtex-II Pro platform FPGA in a 456-ball BGA package, designed for designs that require a balance of programmable logic, embedded memory, and extensive I/O. It provides a platform-level feature set suitable for embedded processing, high-performance I/O, and DSP-oriented applications.

Built on the Virtex-II Pro family architecture, the device pairs flexible logic resources with on-chip memory and platform features documented in the Virtex‑II Pro specification to support complex system integration and high-density implementations.

Key Features

• Logic Resources — 1232 CLBs and 11,088 logic elements provide a sizeable fabric for implementing control logic, custom datapaths, and glue logic.
• Embedded Memory — Approximately 0.811 Mbits of on-chip RAM (811,008 total bits) for packet buffering, FIFOs, and local storage.
• I/O Capacity — 248 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Platform Features (Virtex‑II Pro family) — Family documentation lists capabilities such as embedded PowerPC processor blocks, RocketIO multi‑gigabit transceivers, 18‑bit × 18‑bit multiplier blocks, and SelectRAM+ memory hierarchy for designs that target the Virtex‑II Pro platform.
• Power — Core supply range of 1.425 V to 1.575 V for stable core operation across specified conditions.
• Package & Mounting — 456‑BBGA package (supplier device package: 456‑FBGA, 23×23) with surface‑mount construction for compact board-level integration.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑Speed Communications: Leverage the Virtex‑II Pro platform’s multi‑gigabit transceiver capabilities (family feature) and 248 I/Os for serial links, protocol bridging, or telecom interface implementations.
• Embedded Processing & Control: Use the platform’s support for embedded processor blocks and the device’s logic density to implement system controllers, protocol offload engines, and real‑time control.
• Signal Processing / DSP: Combine the device’s dedicated multiplier resources (platform feature) with ~0.811 Mbits of embedded RAM to implement filters, FFTs, and hardware accelerators.
• Prototyping & System Integration: The mix of logic, memory, and abundant I/O makes this device useful for board‑level prototypes and integration of multiple subsystems on a single FPGA.

Unique Advantages

• Balanced Logic and Memory: 11,088 logic elements paired with approximately 0.811 Mbits of embedded RAM enable integrated datapath and buffering without extensive external memory.
• High I/O Count: 248 I/Os allow flexible interfacing to wide buses, multiple peripherals, and mixed I/O families on a single device.
• Platform Ecosystem: Virtex‑II Pro family documentation provides architecture-level features and reference IP resources that accelerate development for transceivers, embedded processors, and memory subsystems.
• Compact BGA Package: The 456‑BBGA (456‑FBGA, 23×23) offers a high pin density in a compact form factor for space‑constrained boards.
• Commercial Temperature and RoHS Compliance: Commercial grade operation (0 °C to 85 °C) and RoHS compliance support standard industrial and commercial product workflows.
• Stable Core Voltage Range: Narrow core supply range (1.425 V–1.575 V) supports predictable power budgeting and supply design.

Why Choose XC2VP7-6FG456C?

The XC2VP7-6FG456C provides a pragmatic combination of logic density, embedded memory, and high I/O count in a compact 456‑ball BGA package, making it well suited to system designs that require on‑chip buffering, DSP acceleration, and flexible peripheral interfacing. Its placement within the Virtex‑II Pro platform gives access to a documented set of platform features and reference material that can streamline development.

This device is targeted at engineers and teams building commercial temperature‑range systems that need a balanced FPGA fabric for embedded control, communications, and signal processing tasks, with the packaging and electrical characteristics suitable for high‑density board layouts.

If you would like pricing, availability, or a formal quote for XC2VP7-6FG456C, submit a request and our team will respond with the information you need to move your design forward.