XC2VP7-6FGG456I

The XC2VP7-6FGG456I is a Virtex®-II Pro platform FPGA from AMD, offered in a high-density 456‑ball BGA package. It provides a balanced combination of configurable logic, embedded memory, and a large I/O count suitable for industrial-grade embedded systems and control applications.

Designed for applications that require substantial on-chip resources in a compact surface-mount package, this device addresses use cases that demand dense logic, significant embedded RAM, and a wide operating temperature range.

Key Features

• Configurable Logic 1,232 configurable logic blocks and 11,088 logic elements provide the fabric for complex custom logic and control functions.
• Embedded Memory Approximately 0.811 Mbits of on-chip RAM for buffering, state storage, and small lookup tables.
• I/O Density 248 I/O pins to support extensive peripheral and bus interfacing without external expanders.
• Package & Mounting 456‑BBGA (supplier package listed as 456‑FBGA 23×23) in a surface‑mount form factor for compact board layouts.
• Power Specified core supply range of 1.425 V to 1.575 V to match system power rails and regulator designs.
• Industrial Temperature Range Rated for −40 °C to 100 °C operation to meet the demands of industrial environments.
• RoHS Compliance Lead‑free compliant for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control Custom motor control, PLC logic and deterministic I/O handling using the device’s dense logic and broad I/O count.
• Embedded Processing On‑board processing and glue logic for embedded platforms that require both logic density and local RAM.
• Data Aggregation & Interface Bridging High I/O count enables bridging between multiple buses, sensor arrays, and peripheral interfaces.
• Prototyping and Evaluation Platform FPGA capacity suitable for validating system architectures and hardware accelerators in a compact package.

Unique Advantages

• High logic capacity: 11,088 logic elements support complex state machines, datapaths, and control logic without external ASICs.
• Significant on‑chip RAM: Approximately 0.811 Mbits of embedded memory reduces dependence on external RAM for small buffers and LUT data.
• Extensive I/O: 248 I/Os simplify board-level integration by enabling direct connections to multiple peripherals and buses.
• Industrial robust: Rated for −40 °C to 100 °C operation, making it suitable for harsh or temperature-variable environments.
• Compact BGA packaging: 456‑ball BGA (23×23) provides a dense solution for space-constrained PCBs while supporting surface-mount assembly.
• Regulatory readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC2VP7-6FGG456I?

The XC2VP7-6FGG456I positions itself as a practical choice when designers need a mid‑range Virtex®-II Pro FPGA with substantial logic, embedded RAM, and broad I/O in a compact industrial package. Its combination of configurable logic resources and on‑chip memory supports a wide range of embedded and control-focused designs.

This device is suited to engineers who require reliable operation across industrial temperatures, a high pin count for system integration, and a compact surface‑mount BGA footprint for optimized PCB area utilization.

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