XC2VP7-7FGG456C

The XC2VP7-7FGG456C is a Virtex®-II Pro Field Programmable Gate Array (FPGA) manufactured by AMD. It implements the Virtex-II Pro platform architecture and is supplied in a 456-BBGA package with surface-mount mounting, targeting commercial-temperature embedded designs.

Built for applications that require integrated logic, on-chip memory and a high I/O count, this device offers flexible logic resources and family-level features such as embedded PowerPC processor blocks and RocketIO multi-gigabit transceivers as described in the Virtex-II Pro datasheet.

Key Features

• Logic Capacity — 11088 logic elements and 1232 CLBs provide flexible programmable logic for control, protocol handling and custom datapaths.
• Embedded Memory — Approximately 0.81 Mbits of on-chip RAM (811,008 total bits) for FIFOs, buffers and local storage.
• I/O Density — 248 general-purpose I/O pins to support parallel interfaces and comprehensive board-level connectivity.
• Supply Voltage — Core supply specified at 1.425 V to 1.575 V for precise power design and regulation.
• Package and Mounting — 456-BBGA (supplier device package: 456-FBGA, 23 × 23 mm) in a surface-mount format to support compact board layouts.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• RoHS Compliant — Conforms to RoHS environmental requirements.
• Virtex-II Pro Family Capabilities — Family-level features include up to twenty RocketIO or RocketIO X multi‑gigabit transceivers, up to two IBM PowerPC RISC processor blocks, dedicated 18 × 18 multipliers and advanced clock management (as documented in the Virtex-II Pro datasheet).

Typical Applications

• Telecom and Datacom Systems — Use the device’s family support for RocketIO transceivers and high I/O count to implement serial links, protocol bridging and data-path processing.
• Embedded Processing Platforms — Leverage the Virtex-II Pro family’s embedded PowerPC processor block options for systems that combine programmable logic and embedded RISC processing.
• High‑Performance I/O Control — 248 I/O pins and programmable logic density make the device suitable for complex interface aggregation and packet-handling tasks.

Unique Advantages

• Integrated Logic and Memory: Combines 11088 logic elements with approximately 0.81 Mbits of embedded RAM to implement control, buffering and data processing without external SRAM for many functions.
• High I/O Count: 248 I/O pins enable broad interfacing options and flexible board-level connectivity.
• Compact, High‑Density Package: 456-BBGA (23 × 23 mm FBGA footprint) supports dense system designs while maintaining surface-mount assembly compatibility.
• Commercial Temperature Rating: Specified operation from 0 °C to 85 °C for mainstream electronic products and embedded applications.
• Standards‑Oriented Family Features: The Virtex-II Pro family provides multi‑gigabit transceiver and embedded processor block capabilities (per the family datasheet), reducing system component count where those features are required.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose XC2VP7-7FGG456C?

The XC2VP7-7FGG456C positions itself as a versatile Virtex-II Pro family FPGA combining substantial programmable logic, on-chip memory and a high I/O count in a compact 456-BBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of embedded applications that benefit from integrated processing and high-speed I/O capability.

Designers seeking a solution that delivers flexible logic resources, embedded memory and family-level support for multi-gigabit transceivers and processor blocks will find this part appropriate for prototypes and production systems that align with the specified commercial operating range and electrical supply requirements.

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