XC2VP70-5FF1704C

The XC2VP70-5FF1704C is a Virtex®-II Pro platform FPGA packaged in a 1704-ball flip-chip BGA (42.5 × 42.5 mm) and supplied by AMD. It combines a large pool of programmable logic, abundant embedded memory, and a high I/O count to address complex digital designs in commercial applications.

As a member of the Virtex-II Pro family, the device aligns with the platform’s architecture for flexible logic resources, selectRAM memory hierarchy and advanced I/O capabilities—making it suitable for embedded processing, high-density logic implementation and high-throughput I/O designs.

Key Features

• Programmable Logic — 74,448 logic elements and 8,272 configurable logic blocks (CLBs) provide ample resources for complex logic, state machines and implementation of custom datapaths.
• Embedded Memory — Approximately 6.05 Mbits of on-chip RAM (6,045,696 bits) supports large buffering, FIFOs and memory-intensive logic functions without external memory.
• High I/O Count — 996 user I/O pins enable wide parallel interfaces and dense connectivity for peripherals, sensors and high-speed external devices.
• Package & Mounting — 1704-ball FCBGA (42.5 × 42.5 mm) surface-mount package for high pin-count applications and compact board-level integration.
• Power Supply — Core voltage range of 1.425 V to 1.575 V allows precise power sequencing and compatibility with platform power rails.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Virtex-II Pro Family Capabilities — Family-level features include embedded processor blocks (up to two IBM PowerPC™ cores) and RocketIO multi‑gigabit transceiver support (up to twenty RocketIO or RocketIO X MGTs), SelectI/O™-Ultra, digitally controlled impedance (DCI) I/O and dedicated 18-bit × 18-bit multiplier blocks.
• Standards & Compliance — RoHS compliant.

Typical Applications

• Embedded Processing Platforms — Ideal for systems that integrate FPGA fabric with embedded processor cores (Virtex-II Pro family processor block support) for offload and control tasks.
• High‑Bandwidth Communications — Suited to designs requiring extensive I/O and multi‑gigabit transceiver capability (family-level RocketIO support) for serial links and protocol bridging.
• Signal Processing and DSP — Large logic capacity, dedicated multiplier resources and substantial on-chip RAM enable implementation of real-time filtering, aggregation and custom DSP pipelines.
• Prototyping and System Integration — High pin count and dense logic/memory resources support board‑level prototyping and integration of custom silicon functions into commercial products.

Unique Advantages

• High Integration Density: 74,448 logic elements and approximately 6.05 Mbits of embedded RAM reduce the need for external components and simplify system architecture.
• Extensive I/O Availability: 996 user I/Os accommodate wide parallel buses and multiple peripheral interfaces without multiplexing compromises.
• Scalable Platform Features: As a Virtex-II Pro family device, it benefits from platform capabilities such as embedded processor blocks and RocketIO transceivers for system-level scaling.
• Robust Packaging: 1704-ball FCBGA provides a high pin-count solution in a compact footprint for dense PCB implementations.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant to meet commercial product deployment requirements.
• Controlled Power Profile: Defined core voltage range (1.425 V–1.575 V) supports stable power management and predictable thermal behavior at system level.

Why Choose XC2VP70-5FF1704C?

The XC2VP70-5FF1704C delivers a combination of generous programmable logic, significant embedded memory and high I/O density in a single commercial‑grade FPGA package. It is positioned for designers who need large on-chip resources and the potential to leverage Virtex-II Pro family features—such as embedded processor blocks and multi‑gigabit transceivers—for integrated, high-throughput systems.

This device suits engineering teams developing complex embedded systems, communications hardware, and signal-processing applications that demand scalable logic, abundant RAM and broad connectivity, while maintaining commercial temperature and power requirements.

Request a quote or submit an RFQ to check availability, pricing and lead times for the XC2VP70-5FF1704C.