XC2VP70-5FFG1517C

The XC2VP70-5FFG1517C is a Virtex®-II Pro family Field Programmable Gate Array (FPGA) provided by AMD. It delivers a high-density, configurable logic platform suitable for designs that require extensive logic resources, large on-chip memory, and broad I/O capacity.

Built on the Virtex-II Pro platform architecture, this device targets complex embedded logic and high-I/O applications where integration of logic, memory, and processor resources improves system-level efficiency and design flexibility.

Key Features

• Logic Resources: Approximately 74,448 logic elements with 8,272 CLBs to implement complex digital functions and custom processing pipelines.
• Embedded Memory: Approximately 6.05 Mbits of on-chip RAM to support large buffering, lookup tables, and embedded data storage.
• I/O Capacity: 964 user I/O pins for extensive external interfacing and system integration.
• Package & Mounting: 1517-FCBGA (40×40) package, 1517-BBGA package case; surface-mount mounting for compact board layouts.
• Power Supply: Device supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Operating Temperature: Commercial grade operation from 0 °C to 85 °C for standard industrial and commercial environments.
• RoHS Compliance: Conforms to RoHS environmental requirements.
• Virtex-II Pro Platform Features (family): Family documentation describes support for embedded Multi-Gigabit RocketIO transceivers and optional PowerPC RISC processor blocks as part of the Virtex-II Pro platform architecture.

Typical Applications

• Embedded Processing: Integration of large logic arrays and on-chip memory for real-time data processing and control functions.
• High-Density Logic Systems: Implementation of complex state machines, signal processing pipelines, and custom accelerators that require substantial logic and memory resources.
• High-I/O Interface Designs: Board-level solutions that demand hundreds of I/O signals for sensor arrays, backplane interfaces, or multi-channel data paths.
• Communications & Networking: Designs leveraging the Virtex-II Pro platform’s family-level support for RocketIO transceivers and high I/O counts to handle serial links and packet processing tasks.

Unique Advantages

• High Logic Density: Large pool of logic elements and CLBs enables consolidation of multiple functions into a single FPGA, reducing component count.
• Substantial On-Chip Memory: Approximately 6.05 Mbits of embedded RAM provides headroom for buffering, lookup tables, and state storage without external memory.
• Extensive I/O: 964 I/O pins allow broad peripheral and system connectivity while simplifying board-level routing and integration.
• Compact FCBGA Packaging: 1517-FCBGA (40×40) package supports high-density board designs while delivering thermal and signal integrity characteristics suitable for complex systems.
• Commercial Temperature Rating: Qualified for 0 °C to 85 °C operation to meet typical commercial and industrial application requirements.
• Regulatory Compliance: RoHS-compliant construction supports regulatory and environmental requirements for modern electronic products.

Why Choose XC2VP70-5FFG1517C?

The XC2VP70-5FFG1517C combines significant logic capacity, multi-megabit on-chip memory, and very high I/O count in a compact FCBGA package, making it well suited for designers building feature-rich embedded systems, high-density logic platforms, and communication interfaces. As part of the Virtex-II Pro platform family, it aligns with a documented architecture that includes processor block and transceiver options, enabling integration of embedded processing and high-speed serial functionality where required.

This device is targeted at teams seeking scalable FPGA resources, strong integration potential, and compliance with common commercial environmental requirements, supported by published platform documentation from the manufacturer.

Request a quote or submit a pricing inquiry to evaluate XC2VP70-5FFG1517C for your next design or volume program.