XC2VP70-5FF1704I

The XC2VP70-5FF1704I is a Virtex®-II Pro platform Field Programmable Gate Array supplied in a 1704-FCBGA package (42.5 × 42.5 mm) for surface-mount assembly. It delivers substantial on-chip logic and embedded memory resources alongside a large I/O count and supports the Virtex-II Pro family’s high-performance platform features for demanding industrial and communications-oriented designs.

Key Features

• Logic Capacity  74,448 logic elements to implement complex digital logic and custom processing pipelines.
• Embedded Memory  Approximately 6.05 Mbits of on-chip RAM for buffering, packet storage, and fast local data access.
• I/O Density  996 user I/O pins to support wide parallel interfaces and high-density board-level interconnect.
• Family-Level Processing Blocks  Virtex-II Pro family supports up to two IBM PowerPC RISC processor blocks for tightly integrated hardware/software co-design.
• High-Speed SerDes (Family Feature)  Virtex-II Pro architecture includes support for embedded RocketIO/RocketIO X multi-gigabit transceivers in applicable devices for serial link implementation.
• Dedicated DSP Primitives  Device family includes 18-bit × 18-bit multiplier resources and SelectRAM™ memory hierarchy for efficient signal processing and compute tasks.
• Clock Management  Integrated digital clock management and high-performance routing resources are part of the family architecture for reliable timing control.
• Package & Mounting  1704-FCBGA (1704-BBGA, FCBGA) package, surface-mount, 42.5 × 42.5 mm dimensional footprint.
• Power and Temperature  Core voltage range 1.425 V to 1.575 V; operating temperature range −40 °C to 100 °C suitable for industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High‑Performance Networking  Implement packet processing, protocol bridging and high-density I/O aggregation using the device’s large logic and I/O resources.
• Telecom & Datacom Systems  Leverage family-supported RocketIO transceivers and embedded memory for serial links, framing, and buffering in communications equipment.
• Embedded Processing Platforms  Combine on-chip logic with the Virtex-II Pro family’s PowerPC processor blocks for hardware-accelerated control and real-time processing.
• Industrial Control  Use extensive I/O and robust operating temperature range for factory automation, motion control, and machine-vision front-ends.

Unique Advantages

• Substantial On‑Chip Logic: 74,448 logic elements provide headroom for extensive custom logic, state machines, and datapaths, reducing the need for external ASICs or CPLDs.
• Integrated Memory Resources: Approximately 6.05 Mbits of embedded RAM enables large on-chip buffering and low-latency data handling without external memory reliance.
• High I/O Count: 996 user I/Os support complex board-level interfacing and high channel density designs, simplifying board layout and connectivity.
• Industrial Temperature Rating: −40 °C to 100 °C operation provides suitability for demanding environments where thermal robustness matters.
• Platform-Level Features: Family features such as embedded processor blocks, dedicated multipliers, and SelectRAM memory hierarchy accelerate system design and reduce integration effort.
• RoHS Compliance: Meets regulatory requirements for lead-free assembly and environmental considerations.

Why Choose XC2VP70-5FF1704I?

The XC2VP70-5FF1704I combines a high logic count, substantial on-chip RAM, and a very large I/O complement in a compact FCBGA package, making it well suited for complex embedded systems, communications modules, and industrial applications requiring dense integration and robust thermal performance. As a member of the Virtex‑II Pro family, it benefits from platform-level features such as embedded processor blocks, dedicated DSP primitives, and support for multi-gigabit serial transceivers, enabling hardware/software co-design and accelerated system-level implementation.

Choose this device when your design requires a balance of logic capacity, local memory, and I/O density within an industrial temperature window and a surface-mount FCBGA footprint.

Request a quote or submit an inquiry to receive pricing and availability for the XC2VP70-5FF1704I.