XC2VP70-6FF1517C

The XC2VP70-6FF1517C is a Virtex®-II Pro field programmable gate array (FPGA) in a 1517‑FBGA (40×40) flip‑chip BGA package designed for high‑performance, platform‑style FPGA applications. Built on the Virtex‑II Pro family architecture, the device combines large programmable logic capacity with substantial on‑chip memory and extensive I/O to address demanding telecom, datacom and embedded processing use cases.

Its architecture and platform features—such as multi‑gigabit transceiver support, embedded processor block options and dedicated DSP resources—enable integration of complex digital logic, high‑speed serial links and signal processing into a single package while keeping BOM and board area requirements compact.

Key Features

• Logic Capacity — 74,448 logic elements for implementing large, complex digital designs.
• Embedded Memory — Approximately 6.05 Mbits of on‑chip RAM to support buffers, FIFOs and embedded data storage.
• High I/O Count — 964 user I/O pins to accommodate broad parallel interfacing and multi‑lane connectivity.
• Virtex‑II Pro Platform Capabilities — Platform features include support for RocketIO/RocketIO‑X multi‑gigabit transceivers (family supports up to twenty), up to two embedded PowerPC processor blocks, dedicated 18×18 multipliers, and SelectRAM™+ memory hierarchy (as documented in the family datasheet).
• Programmable I/O and Termination — Platform includes digitally controlled impedance (DCI), on‑chip differential termination and SelectI/O™‑Ultra technology for flexible signal conditioning and interfacing (per family datasheet).
• Clocking and Timing — Integrated clock management and Digital Clock Manager (DCM) features in the platform for robust clock distribution and synthesis (per family datasheet).
• Package & Mounting — 1517‑BBGA, FCBGA package (supplier package: 1517‑FCBGA 40×40); surface‑mount for standard PCB assembly.
• Power & Thermal — Core supply voltage range 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
• Compliance — RoHS compliant; commercial grade device.

Typical Applications

• Telecom / Datacom — Implements high‑speed serial protocols and link aggregation using the platform’s RocketIO multi‑gigabit transceiver capabilities and large I/O count.
• Embedded Processing — Combines programmable logic with embedded processor block options to consolidate application processing and custom hardware acceleration in one device.
• Signal Processing & DSP — Dedicated 18×18 multiplier blocks and substantial on‑chip RAM support filtering, FFTs and other compute‑intensive DSP functions.
• Custom High‑Density I/O Systems — High I/O pin count and flexible I/O termination features enable dense parallel interfaces for cameras, sensors, or backplane connections.

Unique Advantages

• Highly integrated platform: Combines tens of thousands of logic elements with several megabits of embedded RAM to reduce external memory and logic requirements.
• Scalable performance: Platform architecture supports multi‑gigabit transceivers and embedded processor blocks for designs that require both logic density and high‑speed serial links.
• Flexible interfacing: Nearly 1,000 user I/Os and programmable I/O features simplify integration with diverse peripheral and board‑level interfaces.
• Board‑level simplicity: Surface‑mount FCBGA packaging (1517‑FCBGA 40×40) helps contain board area while providing a high pin count for complex systems.
• Regulatory and manufacturing readiness: RoHS compliance and commercial grade temperature range make the device suitable for mainstream embedded and communications products.

Why Choose XC2VP70-6FF1517C?

The XC2VP70-6FF1517C delivers a platform‑class FPGA solution that balances large programmable logic capacity, meaningful on‑chip memory, and extensive I/O in a single FCBGA package. Its Virtex‑II Pro family features—documented multi‑gigabit transceiver support, embedded processor block options, dedicated DSP resources and advanced I/O controls—make it a suitable choice for engineers designing communication systems, embedded processing platforms, and high‑density I/O applications where consolidation and integration reduce system complexity.

For development teams and product designers seeking a commercially graded, RoHS‑compliant FPGA with a broad set of platform capabilities, the XC2VP70-6FF1517C provides a practical, well‑documented building block for mid to high‑complexity designs.

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