XC2VP70-6FF1704C

The XC2VP70-6FF1704C is a Virtex®-II Pro family field-programmable gate array supplied in a 1704-ball flip-chip FCBGA package. It combines high logic density, substantial embedded memory, and a large I/O count for designs that require significant on-chip resources and flexible system integration.

Architected for platform-level applications, the device supports embedded multi-gigabit transceiver technology and on-chip processor blocks as described in the Virtex-II Pro series data, making it suitable for communications, embedded processing, and high-density I/O designs that operate within commercial temperature ranges.

Key Features

• Logic Capacity — 8,272 CLBs and 74,448 logic cells provide substantial programmable logic for complex designs.
• Embedded Memory — Approximately 6.05 Mbits of on-chip RAM (6,045,696 bits) for buffering, lookup tables, and data storage.
• High I/O Count — 996 user I/O pins to support dense external interfacing and parallel data paths.
• Integrated Processor & Transceivers (Series Features) — Virtex-II Pro family devices include support for up to two PowerPC processor blocks and up to twenty RocketIO™/RocketIO X multi-gigabit transceivers (family-level capabilities documented in the datasheet).
• Package — 1704-ball FCBGA (42.5 × 42.5 mm) providing a high-density, surface-mount form factor.
• Power — Core voltage supply range of 1.425 V to 1.575 V to match system power rails.
• Temperature & Grade — Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Compliance — RoHS-compliant construction.

Typical Applications

• Telecom & Datacom Systems — Leverages the Virtex-II Pro family’s RocketIO transceiver features and high I/O density for multi-gigabit serial links and high-speed data paths.
• Embedded Processing Platforms — On-chip processor block support enables hardware/software co-designs and offloads for control and signal processing tasks.
• High-Density I/O Interfaces — The 996 I/Os and dense package suit applications requiring many parallel interfaces, such as backplane bridges and IO expansion modules.
• Platform Prototyping and System Integration — Large logic and memory resources support complex prototypes and system-level integration prior to ASIC or custom hardware deployment.

Unique Advantages

• High Programmable Density: The combination of 8,272 CLBs and 74,448 logic cells lets you implement large, complex logic functions on a single device.
• Substantial On-Chip Memory: Approximately 6.05 Mbits of embedded RAM reduces the need for external memory in many buffering and table-storage use cases.
• Large I/O Footprint: 996 I/Os enable extensive peripheral and high-bandwidth interfacing without multiple devices.
• Platform-Level Integration: Family-documented support for embedded processor blocks and multi-gigabit transceivers simplifies system architectures that require on-chip processing and high-speed serial links.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS-compliant for straightforward use in commercial products.
• Compact, High-Density Package: The 1704-FCBGA (42.5 × 42.5 mm) package delivers dense connectivity in a single surface-mount component.

Why Choose XC2VP70-6FF1704C?

The XC2VP70-6FF1704C positions itself as a high-capacity, commercially graded Virtex-II Pro FPGA suited for designs that require large programmable logic, on-chip memory, and extensive I/O. Its family-level support for embedded processors and multi-gigabit transceivers makes it a strong choice for communications and embedded platform designs that benefit from integrated processing and high-speed serial capability.

For engineering teams seeking a single-device solution to consolidate logic, memory, and interfacing, this part offers a balance of density and system-level features in a RoHS-compliant FCBGA package with defined supply and temperature ranges.

Request a quote or submit an RFQ to check availability and pricing for the XC2VP70-6FF1704C and integrate its capabilities into your next design.