XC2VP70-7FF1704C

The XC2VP70-7FF1704C is a Virtex‑II Pro platform FPGA IC from AMD, supplied in a 1704‑FCBGA surface‑mount package. It delivers high logic density, substantial embedded memory, and a large I/O count for designs that require extensive on‑chip resources in a compact ball‑grid array footprint.

Key Features

• Logic Capacity  Approximately 74,448 logic elements, providing substantial programmable fabric for complex designs.
• Embedded Memory  Approximately 6.05 Mbits of on‑chip RAM for data buffering, state storage, and block memory functions.
• I/O Resources  Up to 996 I/O pins to support dense peripheral connectivity and board‑level interfaces.
• Power and Operating Range  Core supply range 1.425 V to 1.575 V; operating temperature range 0 °C to 85 °C.
• Package and Mounting  1704‑FCBGA (42.5 × 42.5 mm) ball‑grid array; surface‑mount construction for modern PCB assembly.
• Compliance and Grade  Commercial grade device; RoHS compliant for regulatory environmental requirements.
• Virtex‑II Pro Platform Features  As part of the Virtex‑II Pro family, documented platform features include embedded Multi‑Gigabit RocketIO/RocketIO X transceivers, up to two IBM PowerPC RISC processor blocks, dedicated 18‑bit × 18‑bit multiplier blocks, SelectRAM+ memory hierarchy, digitally controlled impedance (DCI) I/O, and advanced clock management circuitry.

Typical Applications

• High‑density FPGA systems  Use the device where large programmable logic and substantial on‑chip RAM are required for complex algorithms and datapath implementations.
• Embedded processing platforms  Leverage the Virtex‑II Pro family’s processor block capabilities for systems that integrate software and hardware acceleration.
• High‑I/O connectivity  Deploy in designs that need nearly 1,000 I/Os for broad peripheral, memory, or board‑level interfacing.
• Communications and transceiver‑based designs  Take advantage of the family’s documented RocketIO transceiver features for multi‑gigabit serial link requirements.

Unique Advantages

• High logic density: Supports large, complex logic designs with approximately 74,448 logic elements, reducing the need for multiple chips.
• Substantial on‑chip memory: Approximately 6.05 Mbits of embedded RAM enables efficient data buffering and local storage without external memory dependence.
• Extensive I/O count: Up to 996 I/Os provide flexibility for dense connectivity, simplifying board routing for multi‑interface systems.
• Platform capabilities: Virtex‑II Pro family features such as embedded transceivers and processor blocks allow tighter system integration where serial links and embedded processing are needed.
• Compact FCBGA package: 1704‑FCBGA (42.5 × 42.5 mm) balances high pin count with a compact board footprint for space‑constrained applications.
• Regulatory readiness: RoHS compliance supports environmentally responsible product design and manufacturing.

Why Choose XC2VP70-7FF1704C?

The XC2VP70-7FF1704C positions itself for designs that demand a combination of high programmable logic capacity, significant embedded memory, and very large I/O capability in a single surface‑mount FCBGA package. It is especially well suited to applications that benefit from the Virtex‑II Pro platform’s family features—such as embedded processor blocks and multi‑gigabit transceivers—while operating within a commercial temperature range.

Choose this device when you need a scalable, resource‑rich FPGA fabric with on‑chip memory and I/O density to consolidate functions and simplify system architecture.

Request a quote or submit a pricing and availability inquiry to evaluate XC2VP70-7FF1704C for your next design.