XC2VP70-6FF1704I

The XC2VP70-6FF1704I is a Virtex®-II Pro platform FPGA supplied in a 1704-FCBGA (42.5 × 42.5 mm) surface-mount package. It delivers a high pin-count, industrial-grade FPGA building block with a broad set of on-chip resources and system-level interfaces documented for the Virtex-II Pro family.

Designed for industrial applications that require large logic capacity, abundant I/O and embedded memory, the device combines 74,448 logic elements with approximately 6.05 Mbits of embedded RAM and 996 I/Os, operating across a 1.425 V to 1.575 V core supply range and an operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity  74,448 logic elements provide substantial programmable fabric for complex digital designs and integration of multiple functions on a single device.
• Embedded Memory  Approximately 6.05 Mbits of on-chip RAM (total RAM bits: 6,045,696) for buffering, state storage and large local data structures.
• I/O Density  996 user I/Os in a high-density 1704-FCBGA package enable extensive external interfacing and parallel connectivity.
• Virtex-II Pro Architecture  Family-level features documented in the Virtex-II Pro datasheet include embedded Multi-Gigabit transceiver support (RocketIO/RocketIO X) and up to two IBM PowerPC RISC processor blocks for tightly integrated embedded processing.
• DSP and Memory Primitives  Family documentation describes dedicated 18-bit × 18-bit multiplier blocks and 18-Kb SelectRAM resources for DSP, filtering and algorithm acceleration.
• Clock and I/O Technology  High-performance clock management and I/O capabilities including digitally controlled impedance (DCI) and SelectI/O™-Ultra technology are called out in the family specification.
• Industrial Grade and Environmental Compliance  Grade: Industrial with an operating range of −40 °C to 100 °C and RoHS compliance for environmental safety.
• Package and Mounting  1704-BBGA / FCBGA package, surface-mount mounting type with supplier device package dimensions 1704-FCBGA (42.5 × 42.5 mm) for high-density system boards.
• Power  Core supply specified between 1.425 V and 1.575 V to match system power-rail design requirements.

Typical Applications

• Industrial control and automation  Extended temperature rating and industrial grade construction make the device suitable for control logic, I/O aggregation and real-time processing in industrial systems.
• Embedded processing and system integration  On-chip processor block support and abundant logic/memory resources enable integrated embedded systems and appliance-class processing tasks.
• Telecom and datacom subsystems  Family transceiver and clock-management features documented in the Virtex-II Pro datasheet support high-speed serial links and protocol processing in networking equipment.
• High-density prototyping and consolidation  Large logic element count and nearly 1,000 I/Os allow designers to consolidate multiple discrete functions and interfaces into a single FPGA to reduce board-level complexity.

Unique Advantages

• High integration density:  74,448 logic elements with ~6.05 Mbits of embedded RAM let you implement large, integrated systems on a single device, reducing external component count.
• Extensive I/O capability:  996 I/Os in a 1704-FCBGA package provide flexible connectivity for parallel buses, multi-channel interfaces and dense board layouts.
• Industrial-ready thermal range:  Rated from −40 °C to 100 °C for deployment in industrial environments where temperature resilience is required.
• Platform-level IP and resources:  Virtex-II Pro family features such as embedded transceivers, processor blocks, dedicated multipliers and SelectRAM resources enable reuse of documented IP and architecture for system-class designs.
• Controlled core voltage:  Specified core supply window (1.425 V–1.575 V) supports predictable power-supply design and system-level power management.
• RoHS compliant:  Compliant status simplifies environmental and regulatory considerations for modern manufacturing.

Why Choose XC2VP70-6FF1704I?

The XC2VP70-6FF1704I positions itself as a high-capacity, industrial-grade Virtex-II Pro FPGA suitable for designs requiring significant programmable logic, sizable embedded memory and a very high I/O count in a single package. Its platform-level resources documented in the Virtex-II Pro datasheet — including transceiver and embedded processor block support, dedicated multipliers and block RAM primitives — make it a practical choice for complex system integration where consolidation and on-chip acceleration are priorities.

This device is well suited to engineering teams and procurement teams targeting robust, field-deployable FPGA solutions for industrial, telecom and embedded processing applications that need deterministic electrical and thermal operating envelopes and comprehensive on-chip resources.

Request a quote or submit an RFQ to procure the XC2VP70-6FF1704I and include your required quantity, delivery needs and any technical questions so we can provide pricing and availability information.