XC2VP70-7FFG1704C

The XC2VP70-7FFG1704C is a Virtex®-II Pro platform FPGA offered by AMD in a 1704-ball FCBGA package. It provides a high-capacity programmable fabric with a large I/O count and on-chip memory suitable for embedded processing, high-speed serial interfaces and compute-optimized logic.

This device combines a sizeable logic resource set with dedicated DSP and memory resources, along with platform-level features such as embedded multi-gigabit transceivers and processor block support as described in the Virtex-II Pro family documentation.

Key Features

• Logic Capacity — 74,448 logic elements (logic cells) and 8,272 configurable logic blocks (CLBs) for complex programmable logic implementations.
• Embedded Memory — Approximately 6.05 Mbits of embedded memory (total RAM bits: 6,045,696) to support buffering, FIFOs and on-chip data storage.
• I/O Density — 996 user I/O pins enabling broad peripheral, parallel bus and high-pin-count system interfaces.
• Integrated Platform Features — Family-level support for up to twenty RocketIO or RocketIO X embedded multi‑gigabit transceivers and up to two IBM PowerPC RISC processor blocks as described in the Virtex‑II Pro series documentation.
• DSP Resources — Dedicated 18-bit × 18-bit multiplier blocks and 18-Kb block SelectRAM resources for signal processing and arithmetic- intensive workloads (family-level features).
• Clocking and I/O Technology — Digital Clock Manager (DCM), global clock multiplexer buffers, SelectI/O™-Ultra technology, digitally controlled impedance (DCI) and on‑chip differential termination (series-level features).
• Power — Core supply range 1.425 V to 1.575 V, providing the specified operating window for the device.
• Package & Mounting — 1704-FCBGA package (42.5 × 42.5 mm), surface-mount package case suitable for high-density board designs.
• Operating Range & Grade — Commercial grade; specified operating temperature 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑Speed Communications — Leverage family-level RocketIO transceiver capability and the device’s high I/O count for serial links, backplane interfaces and telecom/datacom modules.
• Embedded Processing & Control — Support complex embedded applications using the Virtex‑II Pro family’s processor block options alongside abundant logic and memory resources.
• Signal Processing & DSP — Use dedicated 18×18 multipliers and on-chip SelectRAM blocks for filtering, transforms and real‑time data processing tasks.
• High‑Pin‑Count System Integration — 996 I/Os and a large logic fabric enable integration of multiple peripherals, buses and custom interfaces within a single FPGA device.

Unique Advantages

• High integration density: Large logic element count and extensive CLB resources reduce the need for multiple devices in complex designs.
• On‑chip memory and DSP: Approximately 6.05 Mbits of embedded memory combined with dedicated multipliers accelerates data‑intensive and signal processing workloads.
• Platform-level connectivity: Family support for multi‑gigabit transceivers and processor blocks enables integrated solutions for communications and embedded systems.
• Commercial temperature rating: Specified operating range of 0 °C to 85 °C for use in commercial applications.
• RoHS compliance: Meets environmental requirements for lead‑free assembly and regulatory programs.
• Standard FCBGA package: 1704-ball surface-mount FCBGA (42.5 × 42.5 mm) simplifies placement in high-density PCB designs.

Why Choose XC2VP70-7FFG1704C?

The XC2VP70-7FFG1704C delivers a combination of high logic capacity, substantial on‑chip memory and a broad I/O complement in a single commercial‑grade FCBGA package. It is well suited for system designs that require integrated DSP capability, large programmable logic arrays and family-level support for embedded processors and multi‑gigabit connectivity.

This device is appropriate for engineering teams building complex communications, embedded processing or signal‑processing systems where consolidation of functionality into a single FPGA reduces board-level complexity and BOM count while leveraging the Virtex‑II Pro family’s platform features.

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