XC2VP70-7FF1517C

The XC2VP70-7FF1517C is a Virtex®-II Pro platform Field Programmable Gate Array (FPGA) in a 1517-FCBGA surface-mount package. It delivers a large, integrated FPGA fabric with a high I/O count and significant on-chip memory for applications that require dense logic, extensive I/O, and configurable system-level integration.

Designed for commercial-temperature operation, this device targets communications, embedded processing and high-density logic applications where flexible reprogrammability and platform-level features are required.

Key Features

• Logic Capacity  8,272 configurable logic blocks (CLBs) and approximately 74,448 logic cells provide substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 6.05 Mbits of on-chip RAM supports large buffer and data-movement requirements without external memory for many designs.
• High I/O Density  964 user I/O pins enable wide bus interfaces and dense board-level connectivity in a single device.
• Package and Mounting  1517-FCBGA (40×40) package, surface mount format—optimized for high-pin-count, high-density board designs.
• Power Supply  Core supply range from 1.425 V to 1.575 V to match system power rails and design constraints.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Platform-Level Capabilities  Virtex-II Pro family features, as described in the device series documentation, include support for embedded processor blocks (PowerPC™) and RocketIO™ multi-gigabit transceivers in applicable family members.
• Standards Compliance  RoHS compliant to meet common environmental requirements for electronic assemblies.

Typical Applications

• High-density digital processing  Large logic capacity and on-chip memory support complex data-paths, protocol handling, and custom accelerators.
• Telecommunications and Networking  High I/O count and Virtex-II Pro platform transceiver support in the family enable implementation of dense interface and serial communications subsystems.
• Embedded system integration  Platform support for embedded processor blocks allows consolidation of control and data-processing functions within a single FPGA fabric.
• Custom hardware prototypes  Reprogrammable fabric and extensive resources make the device suitable for prototyping system architectures that require rapid iteration.

Unique Advantages

• Large on-chip resource set: Combining thousands of CLBs with tens of thousands of logic cells and multiple megabits of embedded RAM reduces reliance on external components for many designs.
• Very high I/O count: 964 I/Os enable direct interfacing to wide parallel buses, multiple peripherals, and dense connectors without multiplexing compromises.
• High-density BGA package: The 1517-FCBGA (40×40) package supports high pin counts while maintaining a compact PCB footprint.
• Platform flexibility: Leveraging Virtex-II Pro platform capabilities allows integration of embedded processing and high-speed serial features where applicable in the family.
• Commercial-grade reliability: Designed for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial deployment requirements.

Why Choose XC2VP70-7FF1517C?

The XC2VP70-7FF1517C provides a substantial balance of logic density, embedded memory, and I/O capacity in a high-pin-count FCBGA package, making it well suited for systems that require consolidated digital processing, flexible interfacing, and platform-level integration. Its Virtex-II Pro family heritage brings platform features that support embedded processing and high-speed serial interfaces where applicable.

This device is aimed at design teams and integrators who need a capable, reprogrammable solution for commercial-temperature applications that benefits from a mature FPGA architecture and extensive on-chip resources.

Request a quote or submit your procurement request to receive pricing and availability for the XC2VP70-7FF1517C. Our team can assist with lead-time information and order placement.