XC2VP70-6FF1517I

IC FPGA 964 I/O 1517FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 964 6045696 74448 1517-BBGA, FCBGA

Quantity 609 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O964Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8272Number of Logic Elements/Cells74448
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6045696

Overview of XC2VP70-6FF1517I – Virtex®-II Pro Field Programmable Gate Array (FPGA) IC, 1517-FCBGA

The XC2VP70-6FF1517I is a Virtex®-II Pro family FPGA packaged in a 1517-ball FCBGA (40×40) and configured for surface-mount assembly. It delivers high logic capacity and on-chip memory with a large I/O count for complex, compact system designs.

Built for industrial applications, the device combines large programmable logic resources with family-level capabilities such as embedded multi-gigabit transceivers and processor block support, enabling integration of dense logic, high-bandwidth interfacing, and embedded processing into a single device.

Key Features

  • Logic Capacity — 74,448 logic elements and 8,272 CLBs provide substantial programmable logic for complex designs.
  • Embedded Memory — Approximately 6 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
  • I/O Density — Up to 964 user I/Os to support wide parallel interfaces and extensive board-level connectivity.
  • Family-Level Transceivers and Processor Blocks — Virtex-II Pro family features include RocketIO multi-gigabit transceivers and support for up to two PowerPC 405 processor blocks, enabling high-speed serial links and embedded processing (family-level capability).
  • DSP Resources — Dedicated 18-bit × 18-bit multiplier blocks for efficient arithmetic processing (family-level capability).
  • Clock Management — On-chip clock management resources such as Digital Clock Manager (DCM) and global clock buffers (family-level capability) support complex timing architectures.
  • Package & Mounting — 1517-BBGA (1517-FCBGA, 40×40) package in a surface-mount form factor for compact PCB integration.
  • Power — Core voltage supply range of 1.425 V to 1.575 V for predictable power planning.
  • Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Environmental Compliance — RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

  • Industrial Control Systems — Use the industrial temperature rating and high logic density for robust control, signal processing, and interface consolidation in factory or process automation.
  • Embedded Processing Platforms — Family support for PowerPC processor blocks enables tight integration of programmable logic with embedded CPU resources for system-on-chip designs.
  • High-Density I/O and Interface Aggregation — Large I/O count and abundant on-chip memory make the device suitable for applications requiring broad parallel interfaces and local buffering.
  • Telecom and High-Speed Data Links — Family-level RocketIO multi-gigabit transceivers and clock management features support implementation of high-speed serial links and telecom/datacom functions.

Unique Advantages

  • High Logic Integration: 74,448 logic elements and 8,272 CLBs enable complex digital designs to be contained within a single FPGA, reducing board-level component count.
  • Substantial On-Chip Memory: Approximately 6 Mbits of embedded RAM provide local storage for buffering, state machines, and lookup tables, improving system throughput.
  • Extensive I/O: 964 I/Os permit wide parallel interfaces and flexible connectivity without external interface expanders.
  • Industrial Reliability: Rated for −40 °C to 100 °C, the device supports deployment in demanding environments where extended temperature tolerance is required.
  • Flexible Power Planning: Defined core voltage range (1.425 V to 1.575 V) simplifies power-supply selection and thermal budgeting.
  • RoHS Compliance: Meets environmental manufacturing requirements for lead-free assemblies.

Why Choose XC2VP70-6FF1517I?

The XC2VP70-6FF1517I positions itself as a high-capacity, industrial-grade FPGA option for designs that require significant programmable logic, abundant embedded memory, and high I/O density in a compact FCBGA package. Its family-level capabilities for embedded processors and multi-gigabit transceivers further enable integration of complex system functions on a single device.

This part is appropriate for engineering teams developing industrial control platforms, embedded processing solutions, and high-density interface applications that need robust operating conditions, clearly defined power requirements, and a broad feature set tied to the Virtex®-II Pro family.

Request a quote or submit an inquiry for pricing and availability of the XC2VP70-6FF1517I to begin integrating this Virtex®-II Pro FPGA into your next design.

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