XC2VP70-5FFG1704I

The XC2VP70-5FFG1704I is an industrial-grade Virtex‑II Pro FPGA from AMD designed for high-density, programmable system deployments. Built on the Virtex‑II Pro platform, the device combines extensive configurable logic, substantial embedded RAM, and support for multi-gigabit transceivers and embedded processor blocks provided by the family architecture.

This device targets applications that require large logic capacity, high I/O counts, and industrial temperature operation — enabling use in communications, embedded processing, and high-performance control systems where integration and deterministic operation matter.

Key Features

• Core Logic – Approximately 8,272 CLBs and 74,448 logic cells to implement complex digital logic and state machines.
• Embedded Memory – Approximately 6.0 Mbits (6,045,696 bits) of on-chip RAM for buffers, FIFOs, and local storage.
• I/O Capacity – Up to 996 user I/Os to support large peripheral sets, high-channel-count interfaces, and dense board-level connectivity.
• Integrated Platform Features – Virtex‑II Pro family features include on-chip support for embedded PowerPC™ processor blocks and RocketIO/RocketIO X multi‑gigabit transceivers for high-speed serial links.
• Package & Mounting – 1704‑FBGA (1704‑FCBGA) surface-mount package, 42.5 mm × 42.5 mm supplier device package for high-density board integration.
• Power – Core supply voltage range of 1.425 V to 1.575 V for regulated system power design.
• Temperature & Grade – Industrial grade device with operating range from −40 °C to 100 °C, suitable for demanding environments.
• Compliance – RoHS compliant.

Typical Applications

• Telecommunications & Networking – Implements protocol offload, packet processing, and high-speed serial link aggregation using the family’s RocketIO transceiver support.
• Embedded Processing – Combines programmable logic with on‑chip processor block support for adaptable control and signal processing tasks.
• Industrial Control – Industrial temperature rating and large I/O count make it suitable for factory automation, motion control, and distributed I/O concentrators.
• High-Performance Prototyping – High logic density and ample embedded RAM for system emulation, hardware acceleration, and algorithm development.

Unique Advantages

• High Logic Density: Large number of CLBs and logic cells lets you pack complex designs into a single device, reducing board-level BOM.
• Substantial On-Chip Memory: Approximately 6.0 Mbits of embedded RAM minimizes external memory dependence for many buffering and caching needs.
• Extensive I/O: Nearly 1,000 I/Os support broad peripheral and interface requirements without ancillary I/O expanders.
• Platform Integration: Family features for embedded processors and multi‑gigabit transceivers provide a pathway to integrated system architectures and high-speed serial connectivity.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a high-density FCBGA package suited to robust deployments.
• Standards-Friendly Supply: RoHS compliance supports modern environmental and manufacturing requirements.

Why Choose XC2VP70-5FFG1704I?

The XC2VP70-5FFG1704I delivers a combination of high logic capacity, significant embedded memory, and a very large I/O complement in an industrial-grade Virtex‑II Pro platform package. It is well suited to designs that demand on-device integration of logic, memory, and high-speed interfaces while operating across extended temperature ranges.

Engineers building communications equipment, embedded processing platforms, industrial controllers, or high-density prototype systems will find the device’s balance of resources and platform features beneficial for lowering system complexity and consolidating board-level functions.

Request a quote or submit an RFQ for the XC2VP70-5FFG1704I to get pricing and availability information for your next design.