XC2VP70-5FF1517C

The XC2VP70-5FF1517C is a Virtex®-II Pro field programmable gate array (FPGA) supplied in a 1517-ball flip-chip BGA package (1517-FCBGA, 40×40). It implements a Virtex-II platform architecture with SRAM-based in-system configuration and on-chip resources tailored for embedded processing, high-density logic integration, and multi-gigabit serial interfaces.

Designed for commercial-grade applications, this device combines a large logic fabric, substantial on-chip memory, integrated processor blocks and transceiver capability to consolidate system functionality and reduce external component count.

Key Features

• Logic Fabric — 8,272 CLBs providing 74,448 logic cells to implement complex digital functions and custom logic engines.
• Embedded Memory — Approximately 6.05 Mbits of on-chip RAM organized using the SelectRAM+ memory hierarchy for buffering, FIFOs, and data storage.
• I/O Density — 964 programmable I/O pins to support wide parallel interfaces and dense board-level connectivity.
• On-chip Processors — Includes support for up to two IBM PowerPC RISC processor blocks (PowerPC 405 core) for tightly integrated embedded processing.
• Multi-Gigabit Transceivers — Family architecture includes RocketIO multi-gigabit transceiver support for serial communication links.
• DSP Resources — Dedicated 18-bit × 18-bit multiplier blocks for arithmetic and signal-processing acceleration.
• Clock and I/O Technology — High-performance clock management circuitry, SelectIO™-Ultra I/O, and XCITE digitally controlled impedance (DCI) I/O features for robust timing and signal integrity options.
• Package & Power — 1517-BBGA (1517-FCBGA, 40×40) surface-mount package; core supply range 1.425 V to 1.575 V.
• Operating Conditions — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Embedded Systems — On-chip PowerPC processor blocks with abundant logic and RAM enable single-chip embedded control and real-time processing.
• Network and Telecom — RocketIO transceiver capability and high I/O count make the device suitable for serial link aggregation, protocol bridging, and packet processing.
• Signal Processing — Dedicated 18×18 multipliers and large on-chip RAM support DSP tasks such as filtering, transforms, and data buffering.
• High-Density I/O Interfaces — 964 I/O pins enable wide parallel interfaces for cameras, memory buses, or custom peripheral arrays.

Unique Advantages

• High integration density: Large logic cell count and extensive embedded memory reduce the need for external ASICs and memory devices.
• Integrated embedded processing: Built-in PowerPC processor blocks simplify development of software-driven FPGA systems and offload control tasks from external MCUs.
• Flexible I/O and transceivers: A high pin count plus RocketIO transceiver support enables a wide range of interface options without additional PHY components.
• Optimized for DSP workloads: Dedicated multiplier blocks and SelectRAM resources accelerate arithmetic-intensive algorithms directly on-chip.
• Board-level efficiency: Surface-mount 1517-FCBGA package consolidates functionality into a compact footprint while supporting high pin density.

Why Choose XC2VP70-5FF1517C?

The XC2VP70-5FF1517C brings a balanced combination of large logic capacity, substantial embedded memory, integrated processor blocks, and serial transceiver capability within a high-density FCBGA package. It is positioned for commercial designs that require consolidated digital logic, on-chip processing, and flexible I/O without extensive external components.

Engineers targeting embedded control, network interface functions, and DSP-focused designs will find the device's mix of CLBs, RAM, multipliers and I/O advantageous for reducing system BOM, shortening board area, and streamlining integration with existing Virtex-II platform toolflows.

Request a quote or submit a procurement inquiry for the XC2VP70-5FF1517C to receive pricing and availability details for your next design.