XC2VP7-5FG456I
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 248 811008 11088 456-BBGA |
|---|---|
| Quantity | 915 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 248 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1232 | Number of Logic Elements/Cells | 11088 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 811008 |
Overview of XC2VP7-5FG456I – Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 248 811008 11088 456-BBGA
The XC2VP7-5FG456I is a Virtex®-II Pro platform FPGA designed for applications that require a blend of programmable logic, embedded processing, and high-speed serial I/O. It combines on-chip configurable logic, embedded memory, and family-level features such as RocketIO multi-gigabit transceivers and optional PowerPC RISC processor blocks to support complex, integrated designs.
With 1,232 CLBs and 11,088 logic elements, approximately 0.81 Mbits of embedded RAM, and 248 user I/O, this device targets networking, telecom, industrial and embedded compute applications where integration and deterministic operating range matter.
Key Features
- Core Logic 1,232 CLBs delivering 11,088 logic elements for flexible programmable logic implementation.
- Embedded Memory Approximately 0.81 Mbits of on-chip RAM (811,008 total RAM bits) supporting buffering, FIFOs and local storage.
- High-Speed Serial & Processor Options Family-level support includes RocketIO/RocketIO X multi-gigabit transceivers and up to two PowerPC™ RISC processor blocks for integrated serial links and embedded processing.
- I/O and I/O Technology 248 user I/O pins with Digitally Controlled Impedance (DCI) and SelectI/O™ technology for flexible interface configuration.
- Arithmetic and Clocking Dedicated 18-bit × 18-bit multiplier blocks and on-chip clock management (Digital Clock Manager) to support DSP and timing-critical functions.
- Package & Mounting 456-ball BGA package (456-FBGA, 23 × 23) in a surface-mount form factor for compact board designs.
- Power Core supply voltage range of 1.425 V to 1.575 V to match platform power requirements.
- Operating Range & Grade Industrial grade operation with a specified temperature range of −40 °C to 100 °C.
- Compliance RoHS compliant.
Typical Applications
- Telecommunications & Networking Implement protocol processing and high-speed serial links using the platform-level RocketIO transceivers and high I/O count.
- Embedded Processing & Control Combine programmable logic with on-chip PowerPC processor blocks for system-on-chip style designs and real-time control.
- Industrial Systems Use the industrial temperature range and robust I/O to implement motor control, automation interfaces, and deterministic control logic.
- Signal Processing & Data Acquisition Leverage 18×18 multipliers, on-chip RAM and abundant logic elements for DSP tasks, buffering and custom data pipelines.
Unique Advantages
- High-density programmable fabric: 1,232 CLBs and 11,088 logic elements support complex logic integration without external ASICs.
- Substantial embedded memory: Approximately 0.81 Mbits of on-chip RAM for buffering and local storage reduces external memory dependency.
- Integrated high-speed I/O options: Family-level RocketIO transceiver support enables multi-gigabit serial connectivity for telecom and networking designs.
- Embedded processing capability: Family support for up to two PowerPC RISC blocks simplifies mixed software/hardware designs.
- Industrial-ready thermal range: Specified operation from −40 °C to 100 °C for deployment in harsh or temperature-variable environments.
- Compact BGA package: 456-ball FBGA (23 × 23) enables dense board layouts while providing a high I/O count.
Why Choose XC2VP7-5FG456I?
The XC2VP7-5FG456I positions itself as a versatile platform FPGA for engineers who need programmable logic combined with embedded memory, processor options and high-speed serial capability. Its combination of 1,232 CLBs, 11,088 logic elements and approximately 0.81 Mbits of embedded RAM supports complex logic, DSP and buffering tasks within a single device footprint.
Designed for industrial environments and available in a compact 456-ball BGA package, this device is suited to networking, telecom, embedded control and industrial systems that require reliable temperature performance, sizable I/O and on-chip resources to reduce board-level complexity and BOM count.
If you would like pricing, lead-time information, or a formal quote for XC2VP7-5FG456I, submit a request for quote or RFQ and our team will respond with the information you need.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








