XC2VP7-5FG456I

IC FPGA 248 I/O 456FBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 248 811008 11088 456-BBGA

Quantity 915 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case456-BBGANumber of I/O248Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1232Number of Logic Elements/Cells11088
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits811008

Overview of XC2VP7-5FG456I – Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 248 811008 11088 456-BBGA

The XC2VP7-5FG456I is a Virtex®-II Pro platform FPGA designed for applications that require a blend of programmable logic, embedded processing, and high-speed serial I/O. It combines on-chip configurable logic, embedded memory, and family-level features such as RocketIO multi-gigabit transceivers and optional PowerPC RISC processor blocks to support complex, integrated designs.

With 1,232 CLBs and 11,088 logic elements, approximately 0.81 Mbits of embedded RAM, and 248 user I/O, this device targets networking, telecom, industrial and embedded compute applications where integration and deterministic operating range matter.

Key Features

  • Core Logic 1,232 CLBs delivering 11,088 logic elements for flexible programmable logic implementation.
  • Embedded Memory Approximately 0.81 Mbits of on-chip RAM (811,008 total RAM bits) supporting buffering, FIFOs and local storage.
  • High-Speed Serial & Processor Options Family-level support includes RocketIO/RocketIO X multi-gigabit transceivers and up to two PowerPC™ RISC processor blocks for integrated serial links and embedded processing.
  • I/O and I/O Technology 248 user I/O pins with Digitally Controlled Impedance (DCI) and SelectI/O™ technology for flexible interface configuration.
  • Arithmetic and Clocking Dedicated 18-bit × 18-bit multiplier blocks and on-chip clock management (Digital Clock Manager) to support DSP and timing-critical functions.
  • Package & Mounting 456-ball BGA package (456-FBGA, 23 × 23) in a surface-mount form factor for compact board designs.
  • Power Core supply voltage range of 1.425 V to 1.575 V to match platform power requirements.
  • Operating Range & Grade Industrial grade operation with a specified temperature range of −40 °C to 100 °C.
  • Compliance RoHS compliant.

Typical Applications

  • Telecommunications & Networking Implement protocol processing and high-speed serial links using the platform-level RocketIO transceivers and high I/O count.
  • Embedded Processing & Control Combine programmable logic with on-chip PowerPC processor blocks for system-on-chip style designs and real-time control.
  • Industrial Systems Use the industrial temperature range and robust I/O to implement motor control, automation interfaces, and deterministic control logic.
  • Signal Processing & Data Acquisition Leverage 18×18 multipliers, on-chip RAM and abundant logic elements for DSP tasks, buffering and custom data pipelines.

Unique Advantages

  • High-density programmable fabric: 1,232 CLBs and 11,088 logic elements support complex logic integration without external ASICs.
  • Substantial embedded memory: Approximately 0.81 Mbits of on-chip RAM for buffering and local storage reduces external memory dependency.
  • Integrated high-speed I/O options: Family-level RocketIO transceiver support enables multi-gigabit serial connectivity for telecom and networking designs.
  • Embedded processing capability: Family support for up to two PowerPC RISC blocks simplifies mixed software/hardware designs.
  • Industrial-ready thermal range: Specified operation from −40 °C to 100 °C for deployment in harsh or temperature-variable environments.
  • Compact BGA package: 456-ball FBGA (23 × 23) enables dense board layouts while providing a high I/O count.

Why Choose XC2VP7-5FG456I?

The XC2VP7-5FG456I positions itself as a versatile platform FPGA for engineers who need programmable logic combined with embedded memory, processor options and high-speed serial capability. Its combination of 1,232 CLBs, 11,088 logic elements and approximately 0.81 Mbits of embedded RAM supports complex logic, DSP and buffering tasks within a single device footprint.

Designed for industrial environments and available in a compact 456-ball BGA package, this device is suited to networking, telecom, embedded control and industrial systems that require reliable temperature performance, sizable I/O and on-chip resources to reduce board-level complexity and BOM count.

If you would like pricing, lead-time information, or a formal quote for XC2VP7-5FG456I, submit a request for quote or RFQ and our team will respond with the information you need.

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