XC2VP7-5FFG896C

The XC2VP7-5FFG896C is a Virtex®-II Pro field-programmable gate array (FPGA) in an 896-ball flip-chip BGA package, offered by AMD. It combines a robust logic fabric with embedded memory and high pin-count I/O to support complex system functions for commercial applications.

Designed for board-level integration, this surface-mount device delivers 1,232 CLBs (configurable logic blocks) representing 11,088 logic elements, approximately 0.811 Mbits of on-chip RAM, and up to 396 user I/O pins — all within a 31 × 31 mm 896-FCBGA footprint. The device operates at a core supply of 1.425 V to 1.575 V and a commercial temperature rating of 0 °C to 85 °C.

Key Features

• Logic Capacity — 1,232 CLBs providing 11,088 logic elements to implement medium-complexity logic, state machines, and custom datapaths.
• Embedded Memory — Approximately 0.811 Mbits of on-chip RAM for buffering, FIFOs, and lookup storage.
• I/O Density — Up to 396 user I/O pins to support wide parallel interfaces and multiple single-ended or differential connections.
• Package — 896-ball flip-chip BGA (896-FCBGA, 31 × 31 mm) optimized for high-density board designs and surface-mount assembly.
• Power — Core supply voltage specified from 1.425 V to 1.575 V for predictable power budgeting and system-level power design.
• Operating Range — Commercial grade operation from 0 °C to 85 °C suitable for general-purpose electronics and embedded systems.
• Standards & Compliance — RoHS-compliant material status to meet common environmental and manufacturing standards.
• Virtex-II Pro Family Capabilities — The Virtex-II Pro family (series-level) includes features such as embedded multi-gigabit transceivers (RocketIO), optional PowerPC processor blocks, dedicated 18×18 multipliers, SelectRAM memory hierarchy, and Digital Clock Manager (DCM) circuitry; consult the family datasheet for details on available resources and device/package combinations.

Typical Applications

• Telecommunications & Networking — Implement packet processing, protocol bridging, and interface aggregation using the device’s dense I/O and embedded memory.
• Embedded Processing — Use the Virtex-II Pro family’s processor-block-capable architecture for offload and control functions in embedded platforms.
• Signal Processing — Deploy custom DSP pipelines and arithmetic accelerators leveraging the device’s logic fabric and embedded RAM.
• Prototyping & System Integration — Rapidly prototype custom logic and system-level integration with high pin-count I/O and a compact 31 × 31 mm package.

Unique Advantages

• Balanced Logic and Memory — A combination of 11,088 logic elements and approximately 0.811 Mbits of embedded RAM enables a wide range of mid-size designs without external memory for many buffering tasks.
• High I/O Count — 396 I/O pins allow flexible interfacing to multiple peripherals, parallel buses, and mixed-signal front ends.
• Compact High-Density Package — The 896-FCBGA (31×31 mm) package reduces board area while supporting dense routing for complex systems.
• Commercial Grade for General Purpose Designs — Rated 0 °C to 85 °C, suitable for typical commercial electronics and embedded applications.
• Environmentally Compliant — RoHS-compliant construction supports regulatory and manufacturing requirements.

Why Choose XC2VP7-5FFG896C?

The XC2VP7-5FFG896C presents a practical balance of logic capacity, embedded memory, and I/O density in a compact flip-chip BGA package, making it well suited for commercial embedded applications, communications endpoints, and system prototypes that require medium-complexity programmable logic. Backed by the Virtex-II Pro family datasheet and AMD’s platform-level documentation, this device offers designers clear electrical and packaging parameters for predictable integration and power planning.

Engineers looking for a surface-mount FPGA with a defined core voltage range, commercial temperature rating, and high pin count will find the XC2VP7-5FFG896C a capable option for consolidating digital functions and accelerating time-to-market.

Request a quote or submit your requirements to receive pricing and availability for the XC2VP7-5FFG896C. Our team can provide component lead-time and stocking information to support your project schedule.