XC2VP7-5FGG456I
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 248 811008 11088 456-BBGA |
|---|---|
| Quantity | 600 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 248 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1232 | Number of Logic Elements/Cells | 11088 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 811008 |
Overview of XC2VP7-5FGG456I – Virtex®-II Pro FPGA IC (456-BBGA)
The XC2VP7-5FGG456I is a Virtex®-II Pro field programmable gate array (FPGA) in a 456-ball BGA package from AMD. It provides a high-density programmable logic fabric with a substantial embedded memory complement and a broad I/O count, aimed at industrial embedded systems and communications equipment.
As a member of the Virtex-II Pro family, this device aligns with platform-level capabilities such as embedded processor block support and high-performance transceiver options available across the family, while offering specific device-level attributes like 11,088 logic elements, approximately 0.811 Mbits of embedded memory, and 248 user I/O.
Key Features
- Logic Density 11,088 logic elements for implementing medium-to-high complexity digital functions and custom accelerators.
- Embedded Memory Approximately 0.811 Mbits (811,008 bits) of on-chip RAM to support large on-chip buffers, state machines, and data processing tasks.
- High I/O Count 248 user I/O pins to support extensive peripheral, sensor, and external memory interfaces.
- Power Supply Operating core voltage range of 1.425 V to 1.575 V, enabling compatible power-rail integration into system designs.
- Package & Mounting 456-BBGA package (supplier device package: 456-FBGA, 23×23) with surface-mount assembly for compact board layouts.
- Industrial Temperature Range Rated for operation from −40°C to 100°C, suitable for industrial environments.
- Standards & Compliance RoHS compliant, supporting environmental and regulatory requirements for lead-free assemblies.
- Virtex-II Pro Family Capabilities Part of the Virtex-II Pro platform, which includes family-level features such as embedded PowerPC processor blocks, RocketIO multi-gigabit transceivers, dedicated 18×18 multipliers, and advanced clock management (family features vary by device).
Typical Applications
- Telecom & Datacom Systems Leverages Virtex-II Pro family transceiver and I/O capabilities for protocol bridging, packet processing, and high-speed link interfacing in networking equipment.
- Industrial Control & Automation Used for motor control, real-time signal processing, and protocol translation where industrial temperature range and high I/O density are required.
- Embedded Processing Platforms Suitable for designs that benefit from on-chip memory and logic density to implement custom processors, offload engines, or hardware accelerators.
- Data Acquisition & Instrumentation Provides flexible I/O and on-chip RAM for collecting, buffering, and preprocessing sensor and measurement data in industrial test systems.
Unique Advantages
- High integration density: 11,088 logic elements and ~0.811 Mbits of embedded memory reduce external components and streamline board-level design.
- Robust I/O capability: 248 user I/O pins support complex multi-interface systems without adding external I/O expanders.
- Industrial-ready thermal range: Rated from −40°C to 100°C, enabling deployment in challenging factory and field environments.
- Compact surface-mount BGA: 456-BBGA (456-FBGA, 23×23) package enables dense PCB layouts for space-constrained systems.
- Regulatory compliance: RoHS compliant for lead-free manufacturing and broader supply-chain compatibility.
- Platform-level extensibility: As part of the Virtex-II Pro family, the device benefits from family architecture features—such as embedded processor blocks and multi-gigabit transceiver options—available across the family for design scalability.
Why Choose XC2VP7-5FGG456I?
The XC2VP7-5FGG456I offers a balanced combination of logic density, embedded memory, and high I/O count in a compact surface-mount 456-BBGA package, tailored for industrial embedded applications. Its operating voltage range and industrial temperature rating make it suitable for robust system designs that need reliable on-chip resources and flexible interfacing.
This device is well suited for engineers and procurement teams building communication equipment, industrial controllers, and embedded platforms that require an FPGA with significant on-chip resources and platform-level feature options provided by the Virtex-II Pro family.
Request a quote or submit a procurement inquiry to receive pricing and availability for the XC2VP7-5FGG456I.

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