XC2VP7-5FGG456I

IC FPGA 248 I/O 456FBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 248 811008 11088 456-BBGA

Quantity 600 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case456-BBGANumber of I/O248Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1232Number of Logic Elements/Cells11088
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits811008

Overview of XC2VP7-5FGG456I – Virtex®-II Pro FPGA IC (456-BBGA)

The XC2VP7-5FGG456I is a Virtex®-II Pro field programmable gate array (FPGA) in a 456-ball BGA package from AMD. It provides a high-density programmable logic fabric with a substantial embedded memory complement and a broad I/O count, aimed at industrial embedded systems and communications equipment.

As a member of the Virtex-II Pro family, this device aligns with platform-level capabilities such as embedded processor block support and high-performance transceiver options available across the family, while offering specific device-level attributes like 11,088 logic elements, approximately 0.811 Mbits of embedded memory, and 248 user I/O.

Key Features

  • Logic Density  11,088 logic elements for implementing medium-to-high complexity digital functions and custom accelerators.
  • Embedded Memory  Approximately 0.811 Mbits (811,008 bits) of on-chip RAM to support large on-chip buffers, state machines, and data processing tasks.
  • High I/O Count  248 user I/O pins to support extensive peripheral, sensor, and external memory interfaces.
  • Power Supply  Operating core voltage range of 1.425 V to 1.575 V, enabling compatible power-rail integration into system designs.
  • Package & Mounting  456-BBGA package (supplier device package: 456-FBGA, 23×23) with surface-mount assembly for compact board layouts.
  • Industrial Temperature Range  Rated for operation from −40°C to 100°C, suitable for industrial environments.
  • Standards & Compliance  RoHS compliant, supporting environmental and regulatory requirements for lead-free assemblies.
  • Virtex-II Pro Family Capabilities  Part of the Virtex-II Pro platform, which includes family-level features such as embedded PowerPC processor blocks, RocketIO multi-gigabit transceivers, dedicated 18×18 multipliers, and advanced clock management (family features vary by device).

Typical Applications

  • Telecom & Datacom Systems  Leverages Virtex-II Pro family transceiver and I/O capabilities for protocol bridging, packet processing, and high-speed link interfacing in networking equipment.
  • Industrial Control & Automation  Used for motor control, real-time signal processing, and protocol translation where industrial temperature range and high I/O density are required.
  • Embedded Processing Platforms  Suitable for designs that benefit from on-chip memory and logic density to implement custom processors, offload engines, or hardware accelerators.
  • Data Acquisition & Instrumentation  Provides flexible I/O and on-chip RAM for collecting, buffering, and preprocessing sensor and measurement data in industrial test systems.

Unique Advantages

  • High integration density: 11,088 logic elements and ~0.811 Mbits of embedded memory reduce external components and streamline board-level design.
  • Robust I/O capability: 248 user I/O pins support complex multi-interface systems without adding external I/O expanders.
  • Industrial-ready thermal range: Rated from −40°C to 100°C, enabling deployment in challenging factory and field environments.
  • Compact surface-mount BGA: 456-BBGA (456-FBGA, 23×23) package enables dense PCB layouts for space-constrained systems.
  • Regulatory compliance: RoHS compliant for lead-free manufacturing and broader supply-chain compatibility.
  • Platform-level extensibility: As part of the Virtex-II Pro family, the device benefits from family architecture features—such as embedded processor blocks and multi-gigabit transceiver options—available across the family for design scalability.

Why Choose XC2VP7-5FGG456I?

The XC2VP7-5FGG456I offers a balanced combination of logic density, embedded memory, and high I/O count in a compact surface-mount 456-BBGA package, tailored for industrial embedded applications. Its operating voltage range and industrial temperature rating make it suitable for robust system designs that need reliable on-chip resources and flexible interfacing.

This device is well suited for engineers and procurement teams building communication equipment, industrial controllers, and embedded platforms that require an FPGA with significant on-chip resources and platform-level feature options provided by the Virtex-II Pro family.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC2VP7-5FGG456I.

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