XC2VP7-5FG456C

The XC2VP7-5FG456C is an AMD Virtex-II Pro series FPGA in a 456-BBGA package, designed for applications that require a blend of programmable logic, embedded memory, and high-density I/O. Based on the Virtex-II Pro platform architecture, the family includes integrated features such as embedded PowerPC processor blocks and RocketIO multi-gigabit transceivers that support complex system integration.

This device targets commercial-grade systems where in-system reconfigurable logic, substantial embedded memory, and flexible I/O are needed to implement custom digital functions, protocol bridging, or embedded processing tasks.

Key Features

• Programmable Logic — 1,232 CLBs (11,088 logic elements) for implementing custom logic and datapath functions.
• Embedded Memory — Approximately 0.81 Mbits of on-chip RAM (811,008 total RAM bits) to support buffers, FIFOs, and local storage.
• High-Density I/O — 248 user I/O pins to interface with peripherals, memories, and board-level interfaces.
• Package and Mounting — 456-BBGA (supplier package: 456-FBGA, 23×23) with surface-mount assembly for compact board integration.
• Power Supply — Core voltage range of 1.425 V to 1.575 V for system power planning and regulator selection.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C.
• Family-Level Architecture — Virtex-II Pro platform capabilities such as up to twenty RocketIO or RocketIO X multi-gigabit transceivers and up to two embedded IBM PowerPC RISC processor blocks (family features described in the device series documentation).
• DSP and Memory Primitives — Dedicated 18‑bit × 18‑bit multiplier blocks and 18-Kb block SelectRAM resources as part of the Virtex-II Pro architecture.
• Clocking and I/O Control — Platform-level features include Digital Clock Manager (DCM), SelectI/O™-Ultra technology, and Digitally Controlled Impedance (DCI) I/O options (per family documentation).
• Compliance — RoHS-compliant component.

Typical Applications

• Embedded Processing and Offload — Implement custom compute blocks or use embedded processor resources for control and protocol handling.
• High‑Speed Serial and Communications — Leverage family RocketIO transceiver capabilities for multi-gigabit links, protocol bridging, and network interface functions.
• Data Buffering and Memory Interfaces — Use on-chip SelectRAM and block RAM for packet buffering, FIFOs, and intermediate storage in data pipelines.
• Custom Digital Signal Processing — Combine 18×18 multiplier blocks and logic resources for filters, fixed-point DSP, and arithmetic-heavy datapaths.

Unique Advantages

• Integrated Embedded Memory and DSP Primitives: Approximately 0.81 Mbits of on-chip RAM plus dedicated multipliers reduce reliance on external memory and discrete DSP chips for many designs.
• Flexible I/O Density: 248 user I/Os and a 456-BBGA package enable high-density board-level connectivity in a compact footprint.
• Platform-Level Integration: Virtex-II Pro family features—such as embedded processor blocks and RocketIO transceivers—allow system-level functions to be consolidated into a single FPGA fabric.
• Predictable Power and Thermal Planning: Specified core voltage range and commercial operating temperature simplify regulator selection and thermal design for commercial applications.
• RoHS Compliance: Environmentally compliant manufacturing designation supports regulatory needs for many commercial products.

Why Choose XC2VP7-5FG456C?

The XC2VP7-5FG456C brings Virtex-II Pro platform capabilities into a compact 456-BBGA package, combining substantial programmable logic (11,088 logic elements), embedded RAM, and high I/O density for commercial systems. Its family-level architecture supports embedded processing and multi-gigabit serial interfaces, enabling designers to consolidate functions and reduce external component count where applicable.

This device suits engineering teams developing commercial embedded systems that require flexible in-field reconfiguration, on-chip memory for buffering, and a balance of logic resources and I/O. With documented platform features and RoHS compliance, the XC2VP7-5FG456C is positioned for designs where integration and predictable electrical/thermal parameters matter.

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