XC2VP50-7FFG1152C

IC FPGA 692 I/O 1152FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 692 4276224 53136 1152-BBGA, FCBGA

Quantity 1,608 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O692Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5904Number of Logic Elements/Cells53136
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4276224

Overview of XC2VP50-7FFG1152C – Virtex®-II Pro Field Programmable Gate Array (1152-FCBGA)

The XC2VP50-7FFG1152C is a Virtex®-II Pro family FPGA in a 1152‑FCBGA package, designed for embedded and high‑I/O system applications. It combines a large logic fabric with substantial on‑chip memory and broad I/O density to support designs that require embedded processing capability and high‑speed interfaces.

As a Virtex‑II Pro family device, the platform provides architecture and IP support for embedded processor blocks and multi‑gigabit serial transceivers, enabling integration of processor, DSP and I/O functions within a single FPGA footprint.

Key Features

  • Logic Capacity — 53,136 logic elements providing a substantial programmable fabric for complex digital logic integration.
  • Configurable Logic Blocks (CLBs) — 5,904 CLBs for flexible logic partitioning and resource allocation across your design.
  • Embedded Memory — Approximately 4.28 Mbits of on‑chip RAM to support buffering, FIFOs and local storage for datapaths and control logic.
  • I/O Density — 692 user I/O pins to support wide parallel interfaces and multiple high‑pin-count peripherals.
  • Family-Level Embedded Processing and Transceivers — Virtex‑II Pro family features include support for embedded PowerPC processor blocks and RocketIO multi‑gigabit transceivers, plus associated IP and reference support.
  • DSP and Memory Primitives — Family architecture includes dedicated 18‑bit × 18‑bit multipliers and 18‑Kb block RAM resources for DSP and datapath acceleration.
  • Power and Supply — Core voltage supply range 1.425 V to 1.575 V for system power planning and regulator selection.
  • Package and Mounting — 1152‑FCBGA (35 × 35 mm) BGA package, surface‑mount for high‑density PCB integration.
  • Commercial Grade & Compliance — Commercial‑grade device with an operating range of 0 °C to 85 °C and RoHS compliant status.

Typical Applications

  • Embedded Processing Systems — Integration of on‑chip processor blocks and programmable logic for control, protocol handling and system orchestration.
  • High‑Speed Communications — Designs leveraging family multi‑gigabit transceiver support and abundant I/O for backplane, line card or networking equipment.
  • DSP and Signal Processing — Use of dedicated multipliers and block RAM for filters, transforms and real‑time data processing pipelines.
  • Prototyping and Platform Development — FPGA capacity and flexibility suitable for platform validation, IP integration and system prototyping.

Unique Advantages

  • High logic and memory density: 53,136 logic elements and ~4.28 Mbits of embedded RAM let you consolidate complex functions on a single device, reducing external components.
  • Extensive I/O capability: 692 user I/Os enable direct connectivity to multiple parallel buses, sensors and peripherals without excessive board-level multiplexing.
  • Platform-level embedded features: Virtex‑II Pro family support for processor blocks and RocketIO transceivers simplifies system architectures that require tight integration between processing and serial I/O.
  • Dedicated DSP resources: On‑die 18×18 multipliers and block RAM resources accelerate numeric and signal processing workloads while simplifying timing closure.
  • Commercial temperature and RoHS compliance: Commercial operating range (0 °C to 85 °C) and RoHS compliance facilitate deployment in mainstream commercial and telecom systems.
  • Compact BGA packaging: 1152‑FCBGA (35×35) provides high pin count in a compact footprint for PCB area‑efficient designs.

Why Choose XC2VP50-7FFG1152C?

The XC2VP50-7FFG1152C positions itself as a flexible integration platform for embedded and communications applications that require substantial logic capacity, plentiful on‑chip memory and high I/O count. Its Virtex‑II Pro family attributes, including support for embedded processor blocks and multi‑gigabit transceivers, make it suitable for designs that combine processing, DSP and high‑speed interface tasks within a single FPGA.

Designed for commercial systems, the device provides a balance of programmable capacity, DSP primitives and package density backed by extensive family documentation and IP support. It is a strong choice for engineers building complex prototypes, telecom interfaces, or platform-level FPGA solutions where consolidation and integration reduce BOM and board complexity.

If you would like pricing, availability or a formal quotation for XC2VP50-7FFG1152C, request a quote or submit an inquiry and our team will respond with the information you need.

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