XC2VP50-5FFG1152I

IC FPGA 692 I/O 1152FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 692 4276224 53136 1152-BBGA, FCBGA

Quantity 145 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O692Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5904Number of Logic Elements/Cells53136
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4276224

Overview of XC2VP50-5FFG1152I – Virtex®-II Pro FPGA, 1152-FCBGA

The XC2VP50-5FFG1152I is a Virtex®-II Pro family Field Programmable Gate Array (FPGA) in a 1152-FCBGA package designed for industrial applications. This device combines a large logic fabric with abundant I/O and embedded memory to support complex embedded processing, high-density interfacing, and multi-gigabit communications.

As a member of the Virtex-II Pro series, the device benefits from family-level architecture that includes high-performance clock management, dedicated multiplier blocks and multi-gigabit transceiver support, enabling integration of system functions into a single programmable device.

Key Features

  • Logic Capacity — 53,136 logic elements to implement complex control, signal processing and custom compute functions.
  • Embedded Memory — Approximately 4.28 Mbits of on-chip RAM (4,276,224 total RAM bits) for buffering, FIFOs and storage of intermediate data.
  • I/O Density — 692 I/O pins to support high-pin-count peripheral interfaces and multi-channel system connections.
  • Family-Level Transceivers and Processors — Virtex-II Pro family features include RocketIO multi-gigabit transceivers and up to two IBM PowerPC™ RISC processor blocks for integrated serial links and embedded processing (family capability).
  • DSP and Arithmetic Resources — Dedicated 18-bit × 18-bit multiplier blocks and a SelectRAM memory hierarchy for high-throughput arithmetic and DSP workloads (family capability).
  • Clock Management — On-chip digital clock management (DCM) circuitry (family capability) to support flexible clocking and timing schemes.
  • Package and Mounting — 1152-FCBGA (35×35) package, surface-mount construction suitable for high-density PCB assembly.
  • Power — Core supply voltage range of 1.425 V to 1.575 V to match standard FPGA core power rails.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial environments.
  • Standards and Compliance — RoHS compliant.

Typical Applications

  • Embedded Processing and Control — Integrates large logic capacity and on-chip memory to implement custom control engines, protocol offloads and embedded algorithm acceleration.
  • High-Density I/O Systems — High pin count (692 I/Os) supports multi-channel interfaces, FPGA-based gateways, and complex board-level integration.
  • Communications and Data Transport — Family-level RocketIO transceiver support and abundant logic make it suitable for serial link bridging, protocol processing and datacom modules.
  • Signal Processing and DSP — Dedicated multiplier blocks and sizable embedded RAM enable FIR filters, FFTs and other real-time signal processing tasks.

Unique Advantages

  • High Integration Density: Large logic element count and substantial embedded RAM reduce the need for external ASICs and discrete logic, simplifying system BOMs.
  • Flexible I/O and Interfacing: 692 user I/Os and family-level transceiver options support a wide range of interfaces and high-pin-count designs.
  • Industrial Operating Range: −40 °C to 100 °C rating provides thermal headroom for demanding environments and extended temperature operation.
  • Programmable System-on-Chip Potential: Family features such as embedded processor blocks and on-chip peripherals enable consolidation of control and data paths within the FPGA.
  • RoHS Compliant: Meets lead-free and hazardous substance requirements for modern manufacturing flows.
  • Established Architecture: Built on the Virtex-II Pro platform with proven clock management, multiplier and memory subsystem building blocks (family capability).

Why Choose XC2VP50-5FFG1152I?

The XC2VP50-5FFG1152I offers a combination of substantial logic resources, significant embedded memory and very high I/O density in a single industrial-grade FCBGA package. It is well suited for engineers designing complex embedded systems that require a programmable platform with strong DSP capability, robust interfacing and room for system expansion.

Leveraging the Virtex-II Pro family architecture provides access to on-chip multiplier blocks, advanced clock management and multi-gigabit transceiver technology at the family level, enabling scalable designs and longer-term reuse across product iterations.

Request a quote or submit an inquiry to get pricing and availability for XC2VP50-5FFG1152I and technical help determining fit for your design.

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