XC2VP50-5FFG1517C

The XC2VP50-5FFG1517C is a Virtex®-II Pro family field programmable gate array (FPGA) in a 1517-ball flip-chip BGA (FCBGA) package. It provides a high-density logic fabric with a large I/O count and significant on-chip RAM, delivered in a surface-mount package for commercial applications.

With 53,136 logic elements, approximately 4.3 Mbits of embedded memory and 852 I/O pins, this device targets designs that require extensive programmable logic, heavy I/O connectivity and on-chip storage while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity — 53,136 logic elements to implement complex custom logic and system orchestration.
• Embedded Memory — Approximately 4.3 Mbits of on-chip RAM for buffering, FIFOs and local data storage.
• I/O Count — 852 user I/Os for dense board-level connectivity and multi-channel interfacing.
• Package — 1517-ball FCBGA (1517-FCBGA, 40×40) surface-mount package for compact system integration.
• Power — Core supply voltage range 1.425 V to 1.575 V to match standard FPGA power rails.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Compliance — RoHS compliant.
• Family-Level Capabilities — As a Virtex‑II Pro family device, the series documentation describes features such as embedded PowerPC™ processor blocks and RocketIO™ multi-gigabit transceiver technology (series-level information).

Typical Applications

• Telecommunications and Datacom — Leverage the Virtex‑II Pro family’s multi-gigabit transceiver and clocking features (series-level) alongside the device’s high I/O count for protocol handling and data aggregation.
• Embedded Processing Systems — Use on-chip logic density and embedded memory to implement custom processing pipelines and tightly coupled logic for system control.
• I/O-Intensive Interfaces — High pin count supports multi-channel sensor interfaces, high-bandwidth parallel buses and complex board-level routing.
• Prototyping and Custom ASIC Emulation — Large logic capacity and RAM support development of complex designs and hardware validation efforts.

Unique Advantages

• High-logic density: 53,136 logic elements provide the resources needed for large-scale programmable designs without immediate hardware partitioning.
• Significant on-chip RAM: Approximately 4.3 Mbits of embedded memory reduces external memory dependence for many buffering and storage requirements.
• Extensive I/O capability: 852 I/Os allow flexible interfacing to multiple peripherals and high channel counts on a single device.
• Compact FCBGA packaging: 1517-ball FCBGA (40×40) delivers high pin density in a surface-mount form factor for space-constrained systems.
• Commercial readiness: Specified for 0 °C to 85 °C operation and RoHS compliant for mainstream electronics manufacturing.
• Series documentation available: Virtex‑II Pro family datasheet details series-level features such as embedded processors and transceiver options to guide system architecture choices.

Why Choose XC2VP50-5FFG1517C?

The XC2VP50-5FFG1517C positions itself as a high-capacity, I/O-rich FPGA for commercial applications that require substantial programmable logic and on-chip memory. Its combination of 53,136 logic elements, approximately 4.3 Mbits of RAM and 852 I/Os provides designers with the resources to implement complex interfaces, data processing pipelines and integration of multiple subsystems on a single device.

This device is well suited to engineering teams and procurement groups working on telecommunications, embedded processing, high-density I/O systems and prototyping projects that require a documented Virtex‑II Pro family solution in a compact FCBGA package.

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