XC2VP50-5FFG1152C

The XC2VP50-5FFG1152C is a Virtex®-II Pro platform Field Programmable Gate Array manufactured by AMD. It combines dense programmable logic, embedded memory, and a high pin-count FCBGA package for complex system designs that require large I/O and on-chip resources.

Targeted at applications that benefit from integrated processing and high-speed serial/transceiver capabilities, this device offers a balance of logic capacity, embedded RAM, and I/O bandwidth while operating from a 1.425–1.575 V supply within a commercial 0 °C to 85 °C temperature range.

Key Features

• Logic Resources   Approximately 53,136 logic elements distributed across 5,904 CLBs, providing substantial programmable fabric for complex designs.
• Embedded Memory   Approximately 4.28 Mbits of on-chip RAM (4,276,224 total RAM bits) for buffering, state storage, and embedded data processing.
• High I/O Count   692 user I/O pins to support wide parallel interfaces, high-pin-count daughtercards, and complex board-level routing.
• Virtex-II Pro Architecture   Family-level features include support for embedded PowerPC processor blocks, RocketIO multi-gigabit transceivers, dedicated 18×18 multipliers, and advanced clock management circuitry.
• Package and Mounting   1152-pin flip-chip BGA (1152-FCBGA, 35×35 mm) in a surface-mount form factor to optimize board footprint and signal density.
• Power and Thermal   Nominal core supply range of 1.425 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C.
• Compliance   RoHS compliant, helping meet environmental requirements for lead-free assembly.

Typical Applications

• Telecommunications & Datacom   Use the on-chip RocketIO transceiver support and high I/O count for serial links, protocol bridging, and packet processing workloads.
• Embedded Processing   Architectures that combine FPGA fabric with embedded processor blocks for control, offload, or system-management tasks.
• High-Density I/O Systems   Multi-channel acquisition, interface aggregation, and board-level I/O expansion where hundreds of signals must be routed and managed.

Unique Advantages

• High Integration:   Large logic element count and substantial embedded RAM reduce external component count for memory and glue logic.
• Extensive I/O Capacity:   692 I/Os support wide parallel buses and numerous peripheral interfaces without external multiplexing.
• Platform-Level Features:   Family support for embedded PowerPC cores and RocketIO transceivers enables mixed-signal and protocol-rich designs on a single device.
• Compact, High-Pin Package:   1152-FCBGA (35×35 mm) provides high pin density in a compact footprint for board-space constrained designs.
• Design-Ready Electrical Range:   Defined core voltage window (1.425–1.575 V) and commercial temperature rating facilitate predictable power and thermal planning.
• RoHS Compliance:   Conforms to environmental lead-free requirements for modern assembly processes.

Why Choose XC2VP50-5FFG1152C?

The XC2VP50-5FFG1152C positions itself as a high-capacity Virtex®-II Pro FPGA option for designs that need substantial on-chip logic, memory, and I/O in a compact FCBGA package. Its combination of approximately 53k logic elements, roughly 4.28 Mbits of embedded RAM, and 692 I/Os makes it well suited to system-level applications that integrate programmable logic with embedded processing and high-speed serial interfaces.

Choose this device for projects requiring a balance of integration and board-level density while operating within standard commercial temperature and voltage ranges. The Virtex-II Pro family-level features—such as embedded processor support and multi-gigabit transceivers—provide additional architectural flexibility for protocol-rich or compute-offload applications.

If you would like pricing, availability, or to request a quote for the XC2VP50-5FFG1152C, please submit a quote request or contact our sales channel for assistance.