XC2VP50-5FF1517I

The XC2VP50-5FF1517I is a Virtex®-II Pro field programmable gate array (FPGA) in a 1517-ball flip-chip BGA (1517-FCBGA, 40×40) package. It delivers a high level of integration with 53,136 logic elements, approximately 4.276 Mbits of embedded memory, and up to 852 I/O pins, targeting industrial-grade embedded and system-level applications that require extensive logic, memory, and I/O resources.

Built on the Virtex-II Pro platform, the device supports platform-level features such as embedded processor blocks and multi-gigabit transceiver support, offering designers a compact, surface-mount FPGA solution for compute-intensive and I/O-heavy designs.

Key Features

• Logic Capacity — 53,136 logic elements for complex logic and programmable functions.
• Embedded Memory — Approximately 4.276 Mbits of on-chip RAM to support buffering, FIFOs, and data storage.
• High-Density I/O — Up to 852 I/O pins to interface with dense peripheral and system-level connectivity.
• Virtex-II Pro Platform Capabilities — Series-level features include support for embedded Multi-Gigabit Transceivers (RocketIO/RocketIO X) and up to two embedded PowerPC RISC processor blocks, enabling integrated high-speed serial links and processor-assisted system architectures.
• DSP Resources — Dedicated 18-bit × 18-bit multiplier blocks for efficient arithmetic and signal-processing implementations.
• Clock and Configuration — High-performance clock management circuitry and SRAM-based in-system configuration options for flexible timing and update strategies.
• I/O Technology — Digitally Controlled Impedance (DCI) and SelectI/O™-Ultra style features for advanced signal integrity and I/O control (series-level descriptions).
• Package and Mounting — 1517-FCBGA (40×40) surface-mount package suitable for board-level assembly.
• Power and Temperature — Core supply range: 1.425 V to 1.575 V; Operating temperature range: −40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Processing Platforms — Use the device’s processor-block support and abundant logic to implement system-on-chip functions with hardware-accelerated tasks and embedded RISC processing.
• High-Speed Serial Systems — Implement multi-gigabit serial links and protocol bridges leveraging the platform’s RocketIO transceiver capabilities (series-level feature).
• Signal Processing and Telecom — Deploy DSP pipelines using the on-chip multipliers and large embedded RAM for buffering and filtering tasks.
• Industrial Control and Automation — Leverage the industrial temperature grade and extensive I/O for robust control, monitoring, and interface aggregation in industrial environments.

Unique Advantages

• High Integration Density: 53,136 logic elements and large embedded RAM reduce external components and simplify board-level design.
• Flexible I/O Capability: Up to 852 I/O pins accommodate complex peripheral and system interconnect requirements without external multiplexing.
• Platform-Level Features: Series support for embedded processors and multi-gigabit transceivers enables integrated system architectures with fewer discrete devices.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C operation, suitable for a wide range of industrial environments.
• SRAM-Based In-System Configuration: Allows iterative development and field updates without external programming devices.
• Standards-Friendly Packaging: 1517-FCBGA (40×40) surface-mount package aligns with high-density board layouts and automated assembly.

Why Choose XC2VP50-5FF1517I?

The XC2VP50-5FF1517I combines substantial logic capacity, generous embedded memory, and very high I/O counts in a single industrial-grade FCBGA package. It is well suited to designers building complex embedded systems, high-speed I/O interfaces, or compute- and memory-intensive signal-processing functions where integration, deterministic operation, and platform-level capabilities matter.

Choosing this Virtex-II Pro device offers a path to consolidate system functions onto a single FPGA, reduce BOM count, and leverage platform-level features for processor integration and high-speed serial connectivity while operating across an extended industrial temperature range.

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