XC2VP50-5FF1152C

The XC2VP50-5FF1152C is a Virtex®-II Pro field programmable gate array supplied in a 1152-ball flip-chip BGA (1152-FCBGA, 35×35) package. It delivers a substantial logic and I/O footprint for complex, reconfigurable system designs.

Built on the Virtex-II Pro platform, this device targets applications that require dense programmable logic, ample embedded memory and broad I/O capability, while operating from a 1.425 V to 1.575 V core supply and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  53,136 logic elements (cells) and 5,904 CLBs provide a large programmable fabric for glue logic, accelerators or custom datapaths.
• Embedded Memory  Approximately 4.276 Mbits of on-chip RAM to support buffering, FIFOs, and local storage for high-throughput designs.
• I/O Density  692 user I/O pins enable broad interface options and high pin-count system integration in a single device.
• Package and Mounting  1152-ball FCBGA (35×35) flip-chip BGA package, surface-mount mounting for compact board-level integration.
• Supply and Thermal  Core voltage range 1.425 V–1.575 V and commercial operating temperature from 0 °C to 85 °C for standard embedded and communications environments.
• Platform Capabilities  Virtex-II Pro family features include on-chip processor blocks (up to two IBM PowerPC™ cores), RocketIO™ multi‑gigabit transceivers, SelectRAM™+ memory hierarchy, dedicated 18×18 multipliers and digital clock management circuitry as documented for the platform.
• Standards and Compliance  RoHS compliant to meet global lead-free manufacturing requirements.

Typical Applications

• Telecom & Datacom  Use the device where high I/O counts and family-level RocketIO multi-gigabit transceiver support are required for protocol interfaces and high-speed links.
• Embedded Processing  Leverage the Virtex-II Pro platform’s on-chip processor block capability for tightly integrated control, offload or system management functions.
• Signal Processing & Acceleration  Large logic capacity, dedicated multipliers and substantial embedded RAM make the device suitable for custom DSP pipelines, packet processing or hardware acceleration.
• Prototyping & System Integration  High I/O count and dense logic enable board-level consolidation and rapid iteration for complex system prototypes and integrations.

Unique Advantages

• High Logic Density: 53,136 logic elements and 5,904 CLBs enable complex functions and multi-domain integration in a single FPGA.
• Significant On-Chip Memory: Approximately 4.276 Mbits of embedded RAM reduces dependency on external memory for buffering and local storage.
• Broad Connectivity: 692 user I/Os support multiple parallel interfaces and high-pin-count subsystem connections without additional bridging components.
• Platform-Level Integration: Virtex-II Pro family capabilities—on-chip processor blocks and RocketIO transceivers—allow consolidation of processing and high-speed serial links on-chip.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to suit standard commercial and communications equipment environments.
• RoHS Compliant: Meets lead-free manufacturing requirements for global production.

Why Choose XC2VP50-5FF1152C?

The XC2VP50-5FF1152C combines substantial programmable logic, significant embedded memory and a very high I/O count in a 1152-FCBGA package, offering a compact platform for integration of complex digital systems. Its platform-level features documented for Virtex-II Pro devices—such as processor blocks and multi-gigabit transceiver support—provide design flexibility for communications, embedded processing and signal-processing applications.

This device is suited to teams that need a dense, reconfigurable solution with strong on-chip resources and broad interfacing capability, helping reduce board-level component count and simplify system architecture while supporting commercial temperature operation and RoHS compliance.

Request a quote or submit an inquiry for the XC2VP50-5FF1152C to discuss availability and pricing for your design needs.