XC2VP20-5FF1152I

IC FPGA 564 I/O 1152FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 564 1622016 20880 1152-BBGA, FCBGA

Quantity 1,391 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2320Number of Logic Elements/Cells20880
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1622016

Overview of XC2VP20-5FF1152I – Virtex®-II Pro FPGA, 1152-FCBGA (Industrial)

The XC2VP20-5FF1152I is a Virtex®-II Pro field programmable gate array (FPGA) supplied by AMD, built on the Virtex-II Pro platform architecture. It delivers a programmable logic fabric with substantial on-chip memory and a high I/O count, targeted at industrial and embedded system applications.

This device is positioned for designs that require dense logic capacity, significant embedded memory, and broad external interfacing in a compact 1152-ball FCBGA surface-mount package, with industrial temperature capability and RoHS compliance.

Key Features

  • Programmable Logic  20,880 logic elements for implementing complex digital functions and custom processing pipelines.
  • Embedded Memory  Approximately 1.62 Mbits of on-chip RAM to support buffering, frame storage, and lookup tables without external memory for many functions.
  • High I/O Count  564 user I/O pins provide broad connectivity for parallel buses, high-speed interfaces, and multiple peripherals.
  • Power and Supply  Core supply operating range of 1.425 V to 1.575 V for predictable power design and margining.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
  • Package and Mounting  1152-ball FCBGA (35 × 35) surface-mount package for high-density board layouts and reliable soldered connections.
  • Platform-Level Capabilities  Built on the Virtex-II Pro platform, which includes architecture-level features such as processor block support, SelectRAM memory hierarchy, dedicated 18-bit × 18-bit multiplier blocks, and advanced clock management (as documented in the platform datasheet).
  • Environmental Compliance  RoHS compliant for lead-free manufacturing processes.

Typical Applications

  • Telecom / Datacom Equipment  Platform-level transceiver and clocking features in the Virtex-II Pro family, combined with high logic density and abundant I/O, support packet handling and line-card functions.
  • Embedded Processing and Control  Integration-friendly logic and on-chip memory make the device suitable for embedded controllers, protocol offload engines, and real-time processing tasks.
  • Industrial Automation  Industrial temperature rating and high I/O count enable robust control, sensor aggregation, and deterministic interfacing in factory and process control systems.
  • High-Density I/O Systems  564 I/O pins support multi-channel data acquisition, complex board-level interfaces, and large peripheral arrays.

Unique Advantages

  • High logic capacity: 20,880 logic elements allow implementation of complex state machines, custom accelerators, and substantial glue logic without external programmable devices.
  • Significant on-chip memory: Approximately 1.62 Mbits of embedded RAM reduces dependence on external memory for many buffering and lookup needs, simplifying PCB design.
  • Extensive I/O: 564 user I/Os enable dense connectivity to sensors, transceivers, FPGAs, and peripherals.
  • Industrial robustness: −40 °C to 100 °C operating range and surface-mount FCBGA package support deployment in demanding environments.
  • Platform ecosystem: The Virtex-II Pro platform offers documented architecture features and IP core/reference support to accelerate system development.
  • Regulatory readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC2VP20-5FF1152I?

The XC2VP20-5FF1152I positions itself as a high-capacity, industrial-grade FPGA option for designs that need a combination of dense logic, meaningful on-chip RAM, and a large number of I/Os in a compact FCBGA package. Its core supply range, wide operating temperature, and RoHS compliance make it suitable for long-lived industrial and embedded applications.

Engineers selecting this device benefit from the Virtex-II Pro platform’s documented architectural features and reference support, enabling faster integration of processor blocks, multipliers, and advanced clock management where applicable. It is well suited to system designers requiring scalability, robustness, and a clear technical specification for procurement and development.

Request a quote or submit an inquiry to receive pricing, availability, and assistance sourcing the XC2VP20-5FF1152I for your next design.

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