XC2VP2-6FGG256I

The XC2VP2-6FGG256I is a Virtex®-II Pro Field Programmable Gate Array (FPGA) in a 256‑ball BGA package designed for industrial applications. It provides a programmable logic fabric with on-chip memory and I/O resources suitable for embedded processing, high-speed interfaces, and industrial control systems.

This device belongs to the Virtex‑II Pro family, whose platform-level features include embedded processor block options and multi-gigabit transceiver support as described in the product documentation for the series.

Key Features

• Logic Resources — 3,168 logic elements to implement custom digital functions and control logic.
• Embedded Memory — Approximately 0.22 Mbits of on-chip RAM (221,184 total bits) for buffers, FIFOs, and state storage.
• I/O Capacity — 140 user I/O pins to connect to peripherals, sensors, and external interfaces.
• Package & Mounting — 256‑BGA package (supplier device package: 256‑FBGA, 17×17) with surface-mount assembly.
• Power Supply — Core voltage range 1.425 V to 1.575 V.
• Operating Temperature — Industrial operating range from −40°C to 100°C for elevated environmental tolerance.
• Compliance — RoHS‑compliant for lead‑free manufacturing processes.
• Virtex‑II Pro Series Capabilities — Series documentation describes family features such as embedded PowerPC processor blocks, RocketIO multi‑gigabit transceiver support, SelectRAM and dedicated multiplier blocks (family-level information).

Typical Applications

• Industrial Control — Implement motor control, process automation logic, and deterministic I/O handling within the industrial temperature range.
• Embedded Processing — Use the Virtex‑II Pro family’s embedded processor options and programmable fabric for control-plane functions and system coordination.
• Telecom/Datacom Interfaces — Leverage the family’s multi‑gigabit transceiver capabilities and clocking features for serial link and data transport applications.
• Custom Interfaces & Bridge Logic — Implement protocol translation, aggregation, and custom peripheral interfaces using the available logic and on-chip RAM.

Unique Advantages

• Balanced Logic and Memory — 3,168 logic elements paired with ~0.22 Mbits of embedded RAM supports mid-density designs that require both control logic and buffering.
• Industrial Temperature Range — Rated from −40°C to 100°C to meet demanding environmental requirements in industrial deployments.
• Compact BGA Package — 256‑FBGA (17×17) offers a space-efficient footprint for board-level designs where real estate is constrained.
• Clear Core Voltage Window — Specified supply range (1.425 V–1.575 V) simplifies power sequencing and regulator selection for the FPGA core.
• RoHS Compliance — Supports lead‑free manufacturing flows for regulatory and process alignment.
• Family-Level Integration Options — The Virtex‑II Pro family documentation details embedded processor blocks, multi‑gigabit transceivers, and dedicated DSP/multiplier resources that designers can leverage when choosing a Virtex‑II Pro device.

Why Choose XC2VP2-6FGG256I?

The XC2VP2-6FGG256I provides a practical combination of programmable logic, embedded RAM, and a high-density BGA package tailored for industrial applications requiring reliable operation across a wide temperature range. Its documented family features — including embedded processor and multi‑gigabit transceiver options at the platform level — make it a suitable choice for engineers building embedded processing, interface bridging, and telecom/datacom subsystems.

Choose this FPGA when you need a compact, RoHS‑compliant programmable device with defined logic and memory resources and clear electrical and thermal operating limits. Series documentation and product specifications support system integration and development for production deployments.

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