XC2VP2-6FG256I

The XC2VP2-6FG256I is a Virtex®-II Pro family field programmable gate array (FPGA) in a 256-ball BGA package, offered in an industrial-grade temperature range. It combines programmable logic, substantial on-chip RAM, and a 140‑I/O footprint for embedded and high-performance system designs.

This surface-mount device is suited for applications that require configurable logic, moderate embedded memory, and broad I/O connectivity within a compact 256‑FBGA (17×17) package footprint.

Key Features

• Logic Capacity  3,168 logic elements for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 0.22 Mbits of on-chip RAM (221,184 total RAM bits) to support buffers, state machines, and local data storage.
• I/O Resources  140 user I/Os providing flexible connectivity for parallel interfaces, control signals, and board-level integration.
• Package and Mounting  256‑BGA package (supplier device package: 256‑FBGA, 17×17) designed for surface-mount assembly and compact board layouts.
• Supply Voltage  Core supply range 1.425 V to 1.575 V to match common FPGA power rails.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Regulatory Compliance  RoHS compliant.
• Family-Level Capabilities  Virtex‑II Pro family-level features include embedded processor blocks and high-speed transceiver options as described in the device family specification.

Typical Applications

• Embedded Processing and Control  Use the device where configurable logic and on-chip memory are needed for custom control, protocol handling, or signal conditioning.
• Telecommunications and Datacom  Suitable for systems requiring flexible I/O and FPGA-based interface logic; family-level transceiver and telecom support modes are documented in the Virtex‑II Pro specification.
• Industrial Automation  Industrial temperature rating and wide I/O count make the device appropriate for motor control, industrial networking, and machine interface tasks.

Unique Advantages

• Balanced Logic and Memory  3,168 logic elements combined with approximately 0.22 Mbits of embedded RAM provides a compact, integrated solution for mid-density FPGA designs.
• Broad I/O Connectivity  140 I/Os enable multiple parallel interfaces and mixed-signal board topologies without immediate need for external GPIO expanders.
• Industrial Reliability  −40 °C to 100 °C operating range supports deployment in harsher environments where extended temperature tolerance is required.
• Compact, Surface-Mount Packaging  256‑FBGA (17×17) package allows high-density PCB routing while retaining robust mechanical and electrical characteristics for production assemblies.
• Standards-Friendly Supply  Core supply range of 1.425–1.575 V matches common FPGA power distribution practices for streamlined power design.
• RoHS Compliance  Conforms to RoHS requirements to support environmentally conscious product development.

Why Choose XC2VP2-6FG256I?

The XC2VP2-6FG256I positions itself as a compact, industrial-grade FPGA option within the Virtex‑II Pro family, delivering a measured balance of logic resources, embedded RAM, and substantial I/O in a 256‑BGA footprint. Its temperature rating and RoHS compliance make it appropriate for long‑life industrial and communications designs that require dependable operation across wide temperature ranges.

This device is well suited to engineers and procurement teams seeking a mid-density FPGA for embedded control, interface bridging, or telecommunications logic where board space, I/O count, and industrial operating range are key selection criteria.

If you would like pricing, availability, or to submit a purchase inquiry for XC2VP2-6FG256I, request a quote today.