XC2VP2-6FFG672C

The XC2VP2-6FFG672C is a Virtex®-II Pro platform FPGA in a 672-ball FCBGA package, designed for applications that require a compact, configurable logic fabric with substantial on-chip memory and I/O resources. Built on the Virtex-II Pro architecture, the device supports integrated platform features commonly used for embedded processing, high-speed serial interfaces, and DSP-oriented designs.

With a commercial temperature grade, a supply voltage range of 1.425 V to 1.575 V, and RoHS compliance, this FPGA is positioned for mainstream embedded and communications applications where a combination of logic, on-chip memory, and flexible I/O is required.

Key Features

• Logic Resources  Approximately 3,168 logic elements to implement custom digital functions and control logic.
• Embedded Memory  Approximately 0.22 Mbits of on-chip RAM for buffers, FIFOs, and small data structures.
• I/O Capacity  204 user I/O pins to interface with peripherals, memories, and board-level signals.
• Platform Architecture Highlights  Virtex-II Pro family features shown in the datasheet include embedded PowerPC processor blocks and RocketIO multi‑gigabit transceivers (family-level capability), along with SelectRAM+ and SelectI/O‑Ultra technologies.
• DSP and Clock Management  Dedicated 18-bit × 18-bit multiplier blocks and high-performance clock management resources (Digital Clock Manager) are part of the platform feature set described in the product documentation.
• Package and Mounting  672‑ball FCBGA (27 mm × 27 mm) package, surface-mount mounting type, suitable for compact board layouts.
• Electrical and Thermal  Specified supply voltage range of 1.425 V to 1.575 V and operating temperature range of 0 °C to 85 °C (commercial grade).
• Compliance  RoHS compliant.

Typical Applications

• Telecommunications and Datacom  Leverages the Virtex-II Pro platform’s multi‑gigabit transceiver capability (family feature) and flexible I/O to implement serial links, protocol bridging, and packet processing functions.
• Embedded Processing and Control  On‑chip processor block support (platform feature) and logic resources make the device suitable for embedded control, protocol offload, and system management tasks.
• Signal Processing and DSP  Dedicated 18×18 multiplier blocks and embedded RAM support implementation of filtering, transforms, and other fixed‑point DSP kernels.
• Prototyping and Custom Logic  Compact FCBGA package with 204 I/Os and ~3,168 logic elements enables board‑level prototypes and custom accelerators where space and I/O density are important.

Unique Advantages

• Integrated platform features: The Virtex‑II Pro architecture documented in the datasheet provides embedded processor and high‑speed transceiver capabilities at the family level, enabling tighter integration of control and data paths.
• Balanced resource mix: A combination of ~3,168 logic elements, embedded RAM, and dedicated multipliers lets you implement control logic, buffers, and DSP functions on a single device.
• High I/O count: 204 user I/Os support complex board interfaces and multiple peripheral connections without external GPIO expanders.
• Compact package: The 672‑ball FCBGA (27×27 mm) provides a small footprint for space‑constrained designs while preserving I/O density.
• Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operating range and RoHS status simplify integration into mainstream electronic products.

Why Choose XC2VP2-6FFG672C?

The XC2VP2-6FFG672C delivers a balanced FPGA solution combining configurable logic, embedded memory, DSP multipliers, and a high I/O count in a compact FCBGA package. It is well suited to designs that require integration of control and data‑path functions on a single device and benefits from the documented Virtex‑II Pro platform capabilities described in the product literature.

This device is a practical choice for engineers and procurement teams targeting embedded systems, communications interfaces, and signal processing applications that need verified platform features, compact packaging, and clear electrical and thermal specifications for commercial‑grade deployments.

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