XC2VP2-6FF672I

The XC2VP2-6FF672I is a Virtex®-II Pro Field Programmable Gate Array (FPGA) supplied in a 672-FCBGA (27×27) package. It provides a combination of configurable logic, embedded memory, and a high count of general-purpose I/O suited for industrial-grade embedded and control applications.

Built on the Virtex-II Pro platform, the device targets applications that require on-chip logic density, predictable power rails and wide operating temperatures, with platform-level IP and reference support available for system development.

Key Features

• Logic Resources — 352 CLBs and 3,168 logic elements provide the programmable fabric for custom digital functions and state machines.
• Embedded Memory — 221,184 bits of on-chip RAM (approximately 0.21 Mbits) for buffering, FIFOs and small data stores.
• I/O Capacity — 204 general-purpose I/O pins to interface with peripherals, buses and external devices.
• Power Supply — Core voltage specified at 1.425 V to 1.575 V for predictable power design and decoupling choices.
• Package and Mounting — 672-FCBGA package (27×27) in a surface-mount form factor for high-density board integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to support industrial and harsh-environment deployments.
• Standards Compliance — RoHS compliant to meet environmental and regulatory requirements.
• Platform-Level Support — Part of the Virtex-II Pro family, which includes platform IP cores and reference material to accelerate development.

Typical Applications

• Industrial Control — On-board logic and I/O count enable custom control algorithms, motor control interfaces and deterministic signal handling across a wide temperature range.
• Embedded Processing — FPGA logic and embedded memory suitable for glue logic, protocol bridging and on-chip processing elements within embedded systems.
• I/O-Intensive Interfaces — 204 I/O pins support designs that require multiple parallel buses, sensor arrays or high pin-count peripheral connectivity.
• Prototyping and Evaluation — The Virtex-II Pro platform and package options make this device appropriate for board-level prototypes and functional validation of FPGA-based systems.

Unique Advantages

• High integration density: 352 CLBs and 3,168 logic elements reduce the need for external glue logic and consolidate system functions on a single device.
• Embedded memory onsite: Approximately 0.21 Mbits of RAM supports buffering and small local storage without external memory.
• Robust industrial operation: −40 °C to 100 °C rating and industrial grade classification enable deployment in harsh environments.
• Compact, high-I/O package: 672-FCBGA (27×27) delivers a large I/O count in a compact surface-mount footprint for dense board designs.
• Predictable power requirements: Defined core voltage range (1.425 V–1.575 V) simplifies power-supply design and thermal planning.
• Environmental compliance: RoHS compliance helps meet modern regulatory and manufacturing requirements.

Why Choose XC2VP2-6FF672I?

The XC2VP2-6FF672I combines a Virtex-II Pro platform architecture with a practical set of on-chip resources—logic, embedded RAM and abundant I/O—targeted at industrial and embedded applications. Its industrial temperature rating, surface-mount 672-FCBGA package and clearly defined power envelope make it suitable for designs that demand reliable operation across a wide thermal range and dense board-level integration.

For engineering teams seeking a platform with available family-level IP and reference support, this device provides a solid foundation for custom digital logic, interface bridging and I/O-rich system functions while maintaining environmental compliance.

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