XC2VP2-5FGG456I

IC FPGA 156 I/O 456FBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 156 221184 3168 456-BBGA

Quantity 959 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case456-BBGANumber of I/O156Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs352Number of Logic Elements/Cells3168
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of XC2VP2-5FGG456I – Virtex®-II Pro Field Programmable Gate Array (456-BBGA, Industrial)

The XC2VP2-5FGG456I is a Virtex®-II Pro platform Field Programmable Gate Array (FPGA) IC supplied in a 456-ball BGA package and rated for industrial operation. It combines a compact surface-mount 456-FBGA (23×23) package with a mid-range logic resource set and on-chip embedded memory for embedded processing, high-density I/O, and industrial applications.

Designed on the Virtex-II Pro family architecture, the series offers platform-level capabilities such as embedded processor block options and high-speed serial transceiver technology for applications in communications, embedded systems, and industrial control where integration and rugged temperature performance matter.

Key Features

  • Logic Capacity — 3168 logic elements provide mid-range programmable logic for glue logic, protocol handling, and control tasks.
  • Embedded Memory — Approximately 0.22 Mbits (221,184 bits) of on-chip RAM to support buffering, lookup tables, and small data storage requirements.
  • I/O Density — 156 user I/O pins suitable for multiple parallel interfaces and mixed-signal front-end connections.
  • Power Supply Range — Core supply specified at 1.425 V to 1.575 V, enabling defined power sequencing and design margining.
  • Industrial Temperature Grade — Rated for −40 °C to 100 °C operation for deployment in industrial environments.
  • Package & Mounting — 456-BBGA (supplier package 456-FBGA, 23×23) in a surface-mount format for high-density PCB implementations.
  • RoHS Compliant — Conforms to RoHS requirements for reduced hazardous substances.
  • Virtex-II Pro Platform Capabilities — The Virtex-II Pro family includes features such as embedded PowerPC processor block options, RocketIO multi-gigabit transceiver technology, dedicated multiplier blocks, and SelectRAM™ memory hierarchy (series-level capabilities described in the product family datasheet).

Typical Applications

  • Telecommunications & Networking — Use the Virtex-II Pro platform family features for high-speed serial interfaces and protocol handling in communications equipment.
  • Embedded Processing — Ideal for systems that require mid-range programmable logic coupled with on-chip memory for control, preprocessing, or co-processor functions.
  • Industrial Control — Industrial temperature rating and robust I/O count make this device suitable for automation, motor control logic, and factory communications modules.
  • Prototyping & Evaluation — Compact BGA package and family-level processor/transceiver options support system-level prototyping and evaluation of embedded designs.

Unique Advantages

  • Balanced Logic and Memory: 3168 logic elements with approximately 0.22 Mbits of embedded RAM offer a good balance for control and data buffering without excess overhead.
  • High I/O Count: 156 I/O pins enable multiple parallel interfaces and flexible board-level partitioning.
  • Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
  • Compact, Surface-Mount Package: 456-FBGA (23×23) provides high routing density for space-constrained PCBs while maintaining a surface-mount assembly flow.
  • Regulatory Compliance: RoHS compliance simplifies adoption in regions and products requiring reduced hazardous substance components.
  • Platform-Level Integration: Built on the Virtex-II Pro family platform, offering documented series-level features (processor blocks, transceivers, multipliers, SelectRAM) for design scalability and reuse.

Why Choose XC2VP2-5FGG456I?

The XC2VP2-5FGG456I positions itself as a mid-range Virtex-II Pro platform FPGA that combines a practical mix of logic, embedded memory, and a substantial I/O count in a compact 456-BBGA surface-mount package. Its industrial temperature rating and defined core voltage range make it suitable for robust embedded and industrial system designs that require predictable operating margins.

Engineers seeking a platform-oriented FPGA with documented series capabilities—such as embedded processor block options and high-speed transceiver technology—will find the XC2VP2-5FGG456I useful for consolidating discrete functions, accelerating prototyping, and scaling designs within the Virtex-II Pro family.

Request a quote or submit an inquiry for XC2VP2-5FGG456I to obtain pricing, availability, and ordering information for your next design.

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