XC2VP2-6FFG672I

The XC2VP2-6FFG672I is a Virtex®-II Pro family field programmable gate array (FPGA) manufactured by AMD. It provides a compact, surface-mount FCBGA package with a balanced combination of logic capacity, embedded memory, and I/O suitable for industrial systems.

As a member of the Virtex‑II Pro family, the platform offers architecture-level capabilities targeted at communications and embedded-processing applications. The device delivers a practical mix of 3,168 logic elements, substantial on‑chip RAM, and a high I/O count in a 672-ball FCBGA footprint, with industrial temperature grading and RoHS compliance for regulated environments.

Key Features

• Core / Platform  Part of the Virtex‑II Pro platform FPGA family, which provides high-performance FPGA architecture and family-level IP and reference support.
• Logic Capacity  Approximately 3,168 logic elements for implementing custom logic and control functions.
• Embedded Memory  Approximately 0.22 Mbits of on‑chip RAM (221,184 bits) to support buffering, state machines, and small data stores.
• I/O and Package  204 user I/Os in a 672‑ball FCBGA (27 × 27 mm) surface‑mount package for dense board integration.
• Power  Core supply voltage range: 1.425 V to 1.575 V, enabling predictable power provisioning for the FPGA core.
• Temperature & Grade  Industrial grade operation from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Regulatory Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Telecommunications & Data Communications  The Virtex‑II Pro family includes architecture elements used in telecom/datacom systems; this device’s I/O density and family capabilities suit communication interface and protocol implementations.
• Embedded Processing & Control  Family-level support for embedded processor blocks and IP cores makes the device suitable for designs that integrate control, packet handling, or custom processing functions.
• Industrial Automation & Control  Industrial temperature rating and surface‑mount FCBGA packaging allow integration into control systems, motor drives, and factory automation equipment.

Unique Advantages

• Compact, high‑pin package: 672‑ball FCBGA (27 × 27 mm) enables high I/O density in a compact board footprint.
• Balanced logic and memory: 3,168 logic elements combined with approximately 0.22 Mbits of embedded RAM provide flexibility for mixed control and buffering tasks.
• Industrial temperature range: −40 °C to 100 °C grading supports deployment in demanding environmental conditions.
• Predictable core supply: Specified 1.425 V to 1.575 V core voltage range simplifies power‑supply design and qualification.
• High I/O count: 204 I/Os support multiple interfaces and parallel connections without external multiplexing.
• RoHS compliance: Meets environmental mandates for lead‑free manufacturing processes.

Why Choose XC2VP2-6FFG672I?

The XC2VP2-6FFG672I positions itself as a practical industrial-grade member of the Virtex‑II Pro family, delivering a compact FCBGA package with a solid mix of logic, embedded memory, and I/O for communications, embedded processing, and industrial control designs. Its specified voltage range and wide operating temperature make it straightforward to integrate into controlled-power, temperature‑sensitive applications.

Designed to align with Virtex‑II Pro family resources and IP/reference support, this device is suited for engineers seeking a field‑programmable solution that balances integration density, environmental tolerance, and traceable compliance for production environments.

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