XC2VP2-5FG456C

The XC2VP2-5FG456C is a Virtex®-II Pro series FPGA packaged in a 456-ball BGA (23×23) intended for commercial embedded designs. It combines configurable logic, embedded memory, and a broad I/O count to support system-level integration in communications, embedded processing, and high-performance control applications.

Architected for flexible in-system configuration, the device exposes 3,168 logic cells across 352 configurable logic blocks, approximately 0.22 Mbits of embedded RAM, and 156 general-purpose I/O pins while operating from a 1.425 V to 1.575 V supply within a 0 °C to 85 °C commercial temperature range.

Key Features

• Configurable Logic  352 configurable logic blocks delivering 3,168 logic cells for custom logic implementation and system glue logic.
• Embedded Memory  Approximately 0.22 Mbits of on-chip RAM (221,184 total bits) for FIFOs, buffers, and local storage.
• I/O  156 user I/O pins provided in the 456-BBGA package to interface with external peripherals and system buses.
• On‑Chip Resources  Series-level platform features include dedicated 18×18 multipliers, SelectRAM™ memory hierarchy, and clock management resources (as documented in the Virtex‑II Pro product specification).
• Embedded Processor and Transceiver Support (Series)  The Virtex‑II Pro family specification includes options for embedded PowerPC™ processor blocks and RocketIO™ multi‑gigabit transceivers; reference documentation and IP core support are detailed in the family datasheet.
• Power and Temperature  Specified supply range of 1.425 V to 1.575 V and commercial grade operation from 0 °C to 85 °C.
• Package & Mounting  456-ball fine-pitch BGA (456-FBGA, 23×23) in a surface-mount package for compact board-level integration.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Embedded Processing  Use as a programmable logic fabric for offloading control tasks or integrating with embedded processor cores provided by the Virtex‑II Pro family.
• Communications and Interfaces  Suitable for implementing protocol interfaces, I/O aggregation, and custom packet handling leveraging on-chip RAM and I/O count.
• Prototyping and System Integration  Compact BGA packaging and flexible logic resources make the device well-suited for prototype platforms and system-level integration where board area is constrained.
• Signal Processing  On-chip multipliers and block RAM resources support fixed-point DSP kernels, filtering, and control algorithms.

Unique Advantages

• Balanced Logic and Memory  3,168 logic cells paired with ~0.22 Mbits of RAM provide a compact balance of logic and storage for mid-density designs.
• High I/O Count  156 I/O pins enable flexible system interfacing without requiring external I/O expanders.
• Compact BGA Package  The 456-ball FBGA (23×23) reduces PCB footprint while supporting high-density routing for embedded systems.
• Commercial Temperature Range  Rated for 0 °C to 85 °C suitable for a wide range of commercial electronic products.
• Platform Documentation and IP Support  Comprehensive family datasheet and module documentation provide functional descriptions, pinouts, and IP core information to accelerate development.
• RoHS Compliant  Meets environmental compliance requirements for lead-free assembly and product stewardship.

Why Choose XC2VP2-5FG456C?

The XC2VP2-5FG456C offers a practical mix of configurable logic, embedded memory, and I/O density in a compact 456-BBGA package for commercial embedded designs. It is a suitable choice for teams needing a mid-density Virtex‑II Pro FPGA with documented platform features and developer resources.

Engineers designing communication interfaces, embedded control systems, or signal processing blocks will find the device’s logic cells, on-chip RAM, and extensive datasheet support useful for reducing development time and simplifying board-level integration.

Request a quote or submit an inquiry to obtain pricing and availability for the XC2VP2-5FG456C and support your next embedded FPGA design.