XC2VP2-5FG256C

The XC2VP2-5FG256C is a Virtex®-II Pro family FPGA offered in a 256-ball BGA package. It delivers a compact, surface-mount logic and memory resource set suitable for commercial embedded and communications-focused applications.

Built on the Virtex-II Pro platform, this device combines 3,168 logic elements, approximately 0.22 Mbits of embedded RAM and 140 user I/O pins in a 256-FBGA (17×17) package. Key electrical and environmental parameters include a 1.425 V to 1.575 V core supply range, RoHS compliance and a commercial operating range of 0 °C to 85 °C.

Key Features

• Logic Resources  Provides 3,168 logic elements for implementing combinational and sequential logic in a compact FPGA footprint.
• Embedded Memory  Approximately 0.22 Mbits of on-chip RAM to support buffering, FIFOs and small-memory functions without external devices.
• User I/O and Package  140 user I/O pins in a 256-FBGA (17×17) surface-mount package enable dense board-level connectivity while minimizing PCB area.
• Power  Core supply voltage specified at 1.425 V to 1.575 V, enabling stable operation within the defined supply window.
• Temperature and Grade  Commercial grade device specified for an operating temperature range of 0 °C to 85 °C.
• Assembly and Compliance  Surface-mount BGA package and RoHS compliance facilitate standard assembly flows and regulatory requirements.
• Virtex-II Pro Family Capabilities  As part of the Virtex-II Pro family, the device is associated with platform features such as embedded processor block support, multi-gigabit transceiver technology, dedicated multiplier blocks and clock management resources as described in the Virtex-II Pro specification.

Typical Applications

• Communications Modules  Compact I/O and on-chip memory make this FPGA suitable for protocol bridging, aggregation and moderate-speed packet processing in commercial communications equipment.
• Embedded Processing  Use in systems requiring programmable logic alongside family-level embedded processor support for offloading control and data-path tasks.
• Prototyping and Development  A convenient platform for prototyping Virtex-II Pro family designs where a balance of logic, memory and I/O density is required.

Unique Advantages

• Compact, high-density package:  256-FBGA (17×17) delivers substantial I/O and logic capability in a small PCB footprint to help reduce board area.
• Balanced on-chip resources:  3,168 logic elements paired with approximately 0.22 Mbits of embedded RAM supports mixed control and data-path designs without immediate need for external memory.
• Commercial operating range:  Specified 0 °C to 85 °C operation aligns with a wide range of commercial embedded applications.
• Predictable power envelope:  Defined core supply range (1.425 V–1.575 V) helps streamline power-supply design and validation.
• Regulatory compliance:  RoHS compliance supports use in regions and products that require lead-free components.
• Platform-level ecosystem:  Association with the Virtex-II Pro data sheet and family features provides access to documented architecture, IP core and reference support.

Why Choose XC2VP2-5FG256C?

The XC2VP2-5FG256C is positioned for designers who need a commercially rated Virtex-II Pro platform device with a compact BGA package, a balanced combination of logic and embedded memory, and ample I/O for moderate-density designs. Its defined supply range and RoHS-compliant surface-mount package make it straightforward to integrate into commercial embedded and communications products.

For teams building on the Virtex-II Pro family, this device offers the documented platform features and reference resources that aid in development and scalability across related designs.

Request a quote or submit an inquiry to receive pricing and availability information for the XC2VP2-5FG256C.