XC2VP2-5FG256I

The XC2VP2-5FG256I is a Virtex®-II Pro field programmable gate array (FPGA) in a 256-ball BGA package from AMD. It implements a high-performance, SRAM-based FPGA architecture with dedicated logic, embedded memory, and extensive I/O to address demanding embedded and industrial applications.

With 3,168 logic elements, approximately 0.22 Mbits of on-chip RAM, and 140 user I/O pins, this device is designed for applications that require a compact, surface-mount FPGA solution in an industrial temperature range and RoHS-compliant package.

Key Features

• Logic Resources — 3,168 logic elements (352 CLBs) provide the programmable fabric for custom logic, control, and data-path implementation.
• Embedded Memory — 221,184 bits of on-chip RAM (approximately 0.22 Mbits) for FIFOs, buffers, and on-chip data storage.
• I/O Density — 140 user I/O pins support wide parallel interfaces and mixed-signal connectivity at the board level.
• Package and Mounting — 256-ball BGA (supplier package: 256-FBGA 17×17) in a surface-mount form factor for compact board designs.
• Power Supply — Core voltage range of 1.425 V to 1.575 V to match system power rails.
• Industrial Temperature — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Industry Features (Virtex‑II Pro Family) — Family architecture includes features such as embedded PowerPC processor blocks, SelectRAM memory hierarchy, dedicated 18×18 multipliers, and advanced clock management circuitry.
• Compliance — RoHS-compliant component suitable for lead-free manufacturing processes.

Typical Applications

• Industrial Control — Implement motor control, PLC logic, and deterministic I/O handling using on-chip logic and abundant I/O pins within an industrial temperature range.
• Embedded Processing — Use the Virtex‑II Pro architecture’s processor-block capability and programmable fabric for offloading control tasks and custom peripherals.
• High‑Density I/O Bridging — Act as a protocol bridge or interface adapter where 140 I/O pins and embedded RAM support data buffering and protocol conversion.
• Prototyping and Development — Compact 256-BGA package and surface-mount mounting make the device suitable for prototype boards and production modules requiring a small footprint.

Unique Advantages

• Compact, high-density logic: 3,168 logic elements in a 256-BGA package enable substantial functionality in a small board area.
• On-chip memory for buffering: Approximately 0.22 Mbits of embedded RAM supports frame buffering, FIFOs, and small data stores without external memory.
• Generous I/O count: 140 user I/O pins allow flexible interfacing to sensors, buses, and peripherals without complex board routing compromises.
• Industrial operating range: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging environments.
• Standard surface-mount package: 256-FBGA (17×17) simplifies PCB assembly while preserving signal integrity for dense designs.
• Regulatory-ready: RoHS compliance supports lead-free production workflows.

Why Choose XC2VP2-5FG256I?

The XC2VP2-5FG256I provides a balanced combination of programmable logic, embedded memory, and high I/O count in a compact, industrial-grade BGA package. It is well suited to designers who need a surface-mount FPGA with verified operating temperature and core-voltage ranges for embedded and industrial deployments.

Leveraging the Virtex‑II Pro family architecture and its on-chip resources, this device is appropriate for projects that require integrated processing elements, configurable data paths, and reliable operation over extended temperature ranges—delivering a practical platform for development and production designs.

Request a quote or submit an inquiry to receive pricing and availability for the XC2VP2-5FG256I and to discuss volume needs or delivery timelines.