XC2VP2-6FGG456C

The XC2VP2-6FGG456C is an AMD Virtex®-II Pro platform FPGA supplied in a 456-ball BGA package. It combines configurable logic, embedded memory, and flexible I/O to support system-level integration for commercial embedded and communications applications.

As a member of the Virtex-II Pro family, platform-level capabilities include support for embedded Multi‑Gigabit transceivers and on-chip processor blocks. This device targets designs that require integrated logic resources, embedded RAM, and a high I/O count in a compact surface-mount package.

Key Features

• Configurable Logic — 352 configurable logic blocks (CLBs) providing a total of 3,168 logic elements for custom digital logic implementations.
• Embedded Memory — Approximately 0.22 Mbits of on-chip RAM (221,184 bits) for data buffering and state storage.
• I/O Capacity — 156 user I/O pins to support multiple external interfaces and board-level connectivity.
• Supply and Temperature — Core voltage supply range of 1.425 V to 1.575 V; commercial operating temperature range of 0 °C to 85 °C.
• Package and Mounting — 456-ball BGA package (supplier device package: 456-FBGA, 23×23) designed for surface-mount assembly.
• Platform-Level Capabilities — Virtex‑II Pro family features include optional embedded RocketIO™ Multi‑Gigabit Transceivers, up to two IBM PowerPC™ 405 processor blocks, dedicated 18×18 multipliers, digitally controlled impedance (DCI) I/O, and advanced clock management circuitry.
• Compliance — RoHS compliant, suitable for commercial-grade product builds.

Typical Applications

• Telecom & Datacom: Implement protocol processing and high-speed serial interfaces using the Virtex-II Pro platform transceiver and clock management features.
• Embedded Processing Systems: Integrate custom logic with on-chip processor blocks for control, offload, or system management functions.
• Custom Hardware Acceleration: Use the device's logic elements, embedded RAM, and 18×18 multipliers for application-specific acceleration and signal processing tasks.

Unique Advantages

• Integrated Logic and Memory: Combines thousands of logic elements with on-chip RAM to reduce external memory dependence and simplify board design.
• Flexible I/O Density: 156 I/O pins in a compact 456-BBGA package enable multiple interface options while conserving board area.
• Platform-Level Feature Set: Access to Virtex‑II Pro family capabilities—such as RocketIO transceivers and PowerPC processor blocks—allows designs to leverage established FPGA platform functionality.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation, matching common commercial product requirements.
• RoHS Compliant: Meets environmental compliance expectations for commercial electronic products.

Why Choose XC2VP2-6FGG456C?

The XC2VP2-6FGG456C delivers a balanced mix of configurable logic, embedded memory, and substantial I/O in a surface-mount 456-BBGA footprint. Its Virtex‑II Pro platform heritage brings family-level capabilities—such as multi‑gigabit transceivers and embedded processor blocks—useful for communications and embedded system designs that need integration and flexibility.

This device is appropriate for commercial designs where compact packaging, moderate logic capacity (3,168 logic elements), and on-chip RAM (approximately 0.22 Mbits) are required. Its supply voltage range and package details make it straightforward to integrate into existing power and PCB design flows.

If you would like pricing, availability, or a formal quote for the XC2VP2-6FGG456C, submit a quote request or inquiry and our team will provide the necessary details and lead-time information.