XC2V8000-5FFG1152I

The XC2V8000-5FFG1152I is a high-density Virtex®-II FPGA supplied in a 1152-ball flip-chip BGA package (35×35 mm). It delivers substantial logic capacity and embedded memory in a surface-mount, industrial-grade device suitable for demanding embedded and system-level designs.

With 11648 CLBs, 104,832 logic cells and approximately 3.10 Mbits of on-chip RAM, this device targets applications that require large programmable logic arrays, rich I/O counts and robust thermal/voltage operating ranges.

Key Features

• Core Logic — 11,648 CLBs and 104,832 logic cells provide extensive programmable logic resources for complex digital functions.
• Gate Density — Equivalent to 8,000,000 system gates for high-density designs and advanced logic integration.
• Embedded Memory — Approximately 3.10 Mbits of total on-chip RAM for buffering, state storage and lookup tables.
• I/O Capacity — 824 user I/Os to support wide external interfacing and multi-channel connectivity.
• Package & Mounting — 1152-FCBGA (35×35) flip-chip BGA, surface-mount for PCB assembly in compact, high-pin-count systems.
• Power Supply — Core voltage range 1.425 V to 1.575 V to match established FPGA power architectures.
• Temperature Range — Industrial operating range from −40 °C to 100 °C for reliable operation in harsh environments.
• Compliance — RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High-performance digital processing — Large CLB and logic cell counts enable complex signal processing and algorithm implementation.
• Memory interface controllers — Significant on-chip RAM and many I/Os support DRAM/SRAM interface logic and buffering.
• Networking and communications — High gate density and broad I/O count accommodate protocol implementations and multi-channel data paths.
• Industrial control and automation — Industrial temperature grade and robust packaging make the device suitable for factory and equipment control logic.

Unique Advantages

• High-density programmable fabric: 104,832 logic cells and 11,648 CLBs enable integration of complex functions that reduce external components and PCB area.
• Substantial embedded memory: Approximately 3.10 Mbits of on-chip RAM supports large buffers and state machines without requiring large external memory.
• Extensive I/O capability: 824 I/Os provide flexibility for parallel interfaces, multiple peripherals and broad system connectivity.
• Industrial reliability: Rated for −40 °C to 100 °C operation and supplied in a flip-chip BGA package for stable performance in industrial environments.
• Regulatory readiness: RoHS compliance supports environmental and supply-chain requirements.

Why Choose XC2V8000-5FFG1152I?

The XC2V8000-5FFG1152I combines high gate density, a large pool of CLBs and substantial embedded memory in a single surface-mount FCBGA package, delivering a scalable platform for complex digital designs. Its wide operating temperature and controlled core supply range make it suitable for industrial applications that demand reliable, long-term operation.

This device is well suited to engineering teams and system designers who require significant on-chip resources, large I/O counts and a robust packaging option while maintaining compliance with RoHS environmental standards.

If you would like pricing, availability or a formal quote for the XC2V8000-5FFG1152I, request a quote or submit your requirements and our team will respond promptly.