XC2V8000-5FFG1152C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 824 3096576 1152-BBGA, FCBGA |
|---|---|
| Quantity | 944 Available (as of May 4, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 824 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 104832 | ||
| Number of Gates | 8000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3096576 |
Overview of XC2V8000-5FFG1152C – Virtex®-II FPGA, 1152-FCBGA (824 I/O)
The XC2V8000-5FFG1152C is a Virtex®-II Field Programmable Gate Array (FPGA) from AMD, offered in a 1152-ball flip-chip FCBGA package. It provides high-density programmable logic with a combination of logic elements, embedded memory, and a large I/O complement for complex digital designs.
Designed for applications that require substantial logic capacity, on-chip memory and flexible I/O, this device targets memory interfaces, arithmetic- and data-intensive processing, and high-density integration where a commercial-grade FPGA is required.
Key Features
- Programmable Logic Capacity Approximately 104,832 logic elements and 8,000,000 system gates provide the density needed for complex, high-functionality designs.
- Embedded Memory Approximately 3.1 Mbits of embedded memory (3,096,576 total RAM bits) with architecture support from the Virtex-II platform’s SelectRAM resources.
- I/O and Interface Flexibility 824 user I/O pins delivered in a 1152-FCBGA (35×35) package with SelectIO-style features described in the Virtex-II platform, enabling a wide range of programmable I/O standards and on-chip termination options.
- Arithmetic and DSP Resources Dedicated 18-bit × 18-bit hardware multipliers and fast carry logic chains from the Virtex-II architecture support arithmetic-heavy and DSP-oriented functions.
- Clock Management Platform-level clock management features such as Digital Clock Manager (DCM) modules and multiple global clock multiplexer buffers enable precise clock de-skew and flexible frequency synthesis.
- Package, Power and Mounting Surface-mount 1152-FCBGA package (35×35) with a supply voltage range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
- Standards and Compliance RoHS compliant.
Typical Applications
- High‑Bandwidth Memory Interfaces — Use for SDR/DDR and other DRAM/SRAM interface controllers where on-chip logic density and embedded memory assist complex memory management and buffering.
- DSP and Signal Processing — Hardware multipliers and ample logic elements enable implementation of filters, transforms, and other arithmetic-intensive algorithms.
- Networking and Communications — Large I/O count and platform I/O features support high-speed serial and parallel interfaces for protocol processing and data plane functions.
- Custom SoC and Prototyping — Dense logic, embedded memory, and flexible clocking make the device suitable for prototyping custom processors and integrated systems.
Unique Advantages
- High logic density: Approximately 104,832 logic elements allow consolidation of large designs into a single FPGA, reducing board-level complexity.
- Substantial on‑chip memory: Approximately 3.1 Mbits of embedded RAM provide local storage for buffering, lookup tables, and state machines, minimizing external memory dependency.
- Large I/O complement: 824 I/O pins in a 1152-FCBGA package enable broad external connectivity for interfaces and peripherals.
- Dedicated arithmetic blocks: 18×18 multipliers and fast carry chains accelerate DSP and numeric workloads without using general logic resources.
- Commercial-grade operating range: Specified for 0 °C to 85 °C operation with a defined supply voltage window (1.425 V–1.575 V), supporting typical commercial deployments.
- RoHS compliant: Meets environmental compliance requirements for lead-free assembly.
Why Choose XC2V8000-5FFG1152C?
The XC2V8000-5FFG1152C combines high programmable logic capacity, significant embedded memory, and a large I/O count in a surface-mount 1152-FCBGA package, making it well suited for complex digital systems that require integrated logic, memory and interface flexibility. Its Virtex‑II platform features—such as dedicated multipliers and clock management—support arithmetic-heavy and timing-sensitive designs while enabling consolidation of multiple functions into a single device.
This device is a fit for engineering teams building high-density FPGA-based solutions where performance, integration and predictable operating specifications are required. The combination of on-chip resources and platform-level features supports scalable designs and long-term deployment in commercial environments.
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