XC2V8000-5FFG1152C

IC FPGA 824 I/O 1152FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 824 3096576 1152-BBGA, FCBGA

Quantity 944 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O824Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells104832
Number of Gates8000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3096576

Overview of XC2V8000-5FFG1152C – Virtex®-II FPGA, 1152-FCBGA (824 I/O)

The XC2V8000-5FFG1152C is a Virtex®-II Field Programmable Gate Array (FPGA) from AMD, offered in a 1152-ball flip-chip FCBGA package. It provides high-density programmable logic with a combination of logic elements, embedded memory, and a large I/O complement for complex digital designs.

Designed for applications that require substantial logic capacity, on-chip memory and flexible I/O, this device targets memory interfaces, arithmetic- and data-intensive processing, and high-density integration where a commercial-grade FPGA is required.

Key Features

  • Programmable Logic Capacity Approximately 104,832 logic elements and 8,000,000 system gates provide the density needed for complex, high-functionality designs.
  • Embedded Memory Approximately 3.1 Mbits of embedded memory (3,096,576 total RAM bits) with architecture support from the Virtex-II platform’s SelectRAM resources.
  • I/O and Interface Flexibility 824 user I/O pins delivered in a 1152-FCBGA (35×35) package with SelectIO-style features described in the Virtex-II platform, enabling a wide range of programmable I/O standards and on-chip termination options.
  • Arithmetic and DSP Resources Dedicated 18-bit × 18-bit hardware multipliers and fast carry logic chains from the Virtex-II architecture support arithmetic-heavy and DSP-oriented functions.
  • Clock Management Platform-level clock management features such as Digital Clock Manager (DCM) modules and multiple global clock multiplexer buffers enable precise clock de-skew and flexible frequency synthesis.
  • Package, Power and Mounting Surface-mount 1152-FCBGA package (35×35) with a supply voltage range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
  • Standards and Compliance RoHS compliant.

Typical Applications

  • High‑Bandwidth Memory Interfaces — Use for SDR/DDR and other DRAM/SRAM interface controllers where on-chip logic density and embedded memory assist complex memory management and buffering.
  • DSP and Signal Processing — Hardware multipliers and ample logic elements enable implementation of filters, transforms, and other arithmetic-intensive algorithms.
  • Networking and Communications — Large I/O count and platform I/O features support high-speed serial and parallel interfaces for protocol processing and data plane functions.
  • Custom SoC and Prototyping — Dense logic, embedded memory, and flexible clocking make the device suitable for prototyping custom processors and integrated systems.

Unique Advantages

  • High logic density: Approximately 104,832 logic elements allow consolidation of large designs into a single FPGA, reducing board-level complexity.
  • Substantial on‑chip memory: Approximately 3.1 Mbits of embedded RAM provide local storage for buffering, lookup tables, and state machines, minimizing external memory dependency.
  • Large I/O complement: 824 I/O pins in a 1152-FCBGA package enable broad external connectivity for interfaces and peripherals.
  • Dedicated arithmetic blocks: 18×18 multipliers and fast carry chains accelerate DSP and numeric workloads without using general logic resources.
  • Commercial-grade operating range: Specified for 0 °C to 85 °C operation with a defined supply voltage window (1.425 V–1.575 V), supporting typical commercial deployments.
  • RoHS compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose XC2V8000-5FFG1152C?

The XC2V8000-5FFG1152C combines high programmable logic capacity, significant embedded memory, and a large I/O count in a surface-mount 1152-FCBGA package, making it well suited for complex digital systems that require integrated logic, memory and interface flexibility. Its Virtex‑II platform features—such as dedicated multipliers and clock management—support arithmetic-heavy and timing-sensitive designs while enabling consolidation of multiple functions into a single device.

This device is a fit for engineering teams building high-density FPGA-based solutions where performance, integration and predictable operating specifications are required. The combination of on-chip resources and platform-level features supports scalable designs and long-term deployment in commercial environments.

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