XC2V8000-4FFG1517C

The XC2V8000-4FFG1517C is a Virtex®-II field programmable gate array in a 1517-ball flip-chip BGA (1517-FCBGA) surface-mount package. It combines high logic capacity, abundant I/O and substantial on-chip memory to support complex digital designs in commercial-grade applications.

Built around the Virtex-II platform architecture, this device targets designs that require dense logic resources, extensive embedded RAM and flexible high-speed I/O while operating from a 1.425 V–1.575 V core supply and a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity — 104,832 logic elements (implemented across 11,648 CLBs) providing large-scale logic integration for complex systems.
• Embedded Memory — Approximately 3.1 Mbits of on-chip RAM (3,096,576 total RAM bits) for buffering, packet storage and on-chip data structures.
• I/O Density & Standards — 1,108 user I/Os offering broad interface options; the Virtex-II platform supports a wide range of single-ended and differential I/O standards and high-speed serial interfaces.
• Arithmetic & DSP Support — Dedicated 18-bit × 18-bit multiplier blocks (as part of the Virtex-II feature set) to accelerate arithmetic and DSP functions.
• Clock Management — Integrated clock management features in the Virtex-II family (including Digital Clock Manager blocks) for precise clocking and deskewing in multi-clock designs.
• Package & Mounting — 1517-ball flip-chip BGA (1517-FCBGA, 40 × 40) surface-mount package for high-density board integration.
• Power & Operating Range — Core supply range of 1.425 V to 1.575 V and commercial operating temperature from 0 °C to 85 °C.
• Compliance — RoHS compliant, suitable for commercial applications.

Typical Applications

• High-density logic systems — Implements complex state machines, control logic and protocol engines using the device’s 104,832 logic elements and 11,648 CLBs.
• Embedded memory buffering — Uses approximately 3.1 Mbits of on-chip RAM for packet buffering, FIFOs and line-rate data handling in communications and networking equipment.
• High-speed I/O interfacing — Leverages 1,108 user I/Os and the Virtex-II I/O feature set to connect to a variety of external devices and memory interfaces.

Unique Advantages

• High logic integration: 104,832 logic elements provide the density needed to consolidate multiple functions into a single FPGA, reducing board-level component count.
• Substantial on-chip RAM: Approximately 3.1 Mbits of embedded memory enables significant local storage for low-latency data processing without external memory.
• Extensive I/O: 1,108 available I/Os support broad interfacing options and dense connectivity for multi-channel systems.
• Dedicated arithmetic resources: On-chip 18×18 multipliers accelerate DSP and arithmetic workloads, offloading compute from external processors.
• Commercial readiness: Surface-mount 1517-FCBGA package and RoHS compliance simplify integration into commercial products and manufacturing flows.

Why Choose XC2V8000-4FFG1517C?

The XC2V8000-4FFG1517C positions itself as a high-capacity, commercially graded Virtex-II FPGA suitable for designs that demand large logic arrays, abundant embedded memory and extensive I/O. Its combination of 104,832 logic elements, roughly 3.1 Mbits of on-chip RAM and 1,108 I/Os makes it appropriate for complex digital systems, high-throughput data paths and multi-interface platforms.

For engineering teams seeking scalable performance within the Virtex-II platform, this device offers a balance of integration and flexibility, supported by well-documented platform features and predictable package options for surface-mount assembly.

If you would like pricing, availability or to request a quote for XC2V8000-4FFG1517C, submit an inquiry or request a quote and a member of our team will respond with details.