XC2V8000-4FFG1152I

IC FPGA 824 I/O 1152FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 824 3096576 1152-BBGA, FCBGA

Quantity 125 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O824Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells104832
Number of Gates8000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3096576

Overview of XC2V8000-4FFG1152I – Virtex®-II Field Programmable Gate Array (FPGA) IC

The XC2V8000-4FFG1152I is a Virtex®-II platform FPGA offering high logic density and extensive on-chip memory for complex digital designs. This device combines a large number of logic elements with significant embedded RAM and a wide I/O complement to support compute- and I/O-intensive applications.

Targeted at industrial applications, the device provides a surface-mount 1152-FCBGA package, industrial operating range, and a regulated core voltage window to meet demanding system-level requirements.

Key Features

  • Core logic — 104,832 logic elements and an 8,000,000-gate equivalent capacity to implement large, complex designs.
  • Embedded memory — approximately 3.1 Mbits of on-chip RAM (3,096,576 bits) for buffers, FIFOs and local storage.
  • Programmable I/O — 824 user I/Os to support extensive external interfacing and board-level connectivity.
  • Arithmetic resources — Virtex-II platform includes dedicated 18-bit × 18-bit multiplier blocks for hardware-accelerated arithmetic.
  • Clock management — Digital Clock Manager (DCM) functionality described in the Virtex-II platform for flexible clocking and deskewing.
  • Package and mounting — 1152-FCBGA (35 × 35) flip-chip ball-grid array, surface-mount for compact board integration.
  • Power and supply — core voltage supply range 1.425 V to 1.575 V for regulated power design.
  • Industrial temperature range — rated for −40 °C to 100 °C operation, and specified as Industrial grade.
  • Standards and compliance — RoHS compliant.

Typical Applications

  • Memory interface controllers — high-performance DRAM and SRAM interfaces leveraging on-chip memory and platform-level memory hierarchy.
  • Signal processing and acceleration — hardware arithmetic using dedicated multiplier blocks and local RAM for DSP, filtering, and data-stream operations.
  • High-density I/O bridging — 824 I/Os enable protocol bridging, multi-channel data aggregation, and complex board-level interfaces.
  • Industrial embedded systems — industrial temperature rating and surface-mount package support deployment in rugged control and monitoring equipment.

Unique Advantages

  • High logic capacity: 104,832 logic elements and an 8M-gate equivalent provide headroom for feature-rich FPGA designs without multiple devices.
  • On-chip memory for real-time buffering: approximately 3.1 Mbits of embedded RAM reduces external memory dependence and improves system latency.
  • Extensive I/O: 824 user I/Os enable dense connectivity to peripherals, memory, and high-speed interfaces on a single device.
  • Industrial robustness: −40 °C to 100 °C operating range and industrial grade classification suit demanding environmental requirements.
  • Compact system integration: 1152-FCBGA package optimizes board area while providing high pin count and routing density.
  • Platform-level features: Virtex-II platform capabilities such as SelectRAM memory hierarchy, DCM clock management, and dedicated multipliers support complex system functions.

Why Choose XC2V8000-4FFG1152I?

The XC2V8000-4FFG1152I positions itself as a high-capacity, industrial-grade Virtex-II FPGA optimized for applications that require substantial logic resources, on-chip memory, and extensive I/O. Its combination of 104,832 logic elements, approximately 3.1 Mbits of embedded RAM, and 824 I/Os enables consolidated system designs that reduce external components and simplify board-level architecture.

Backed by the Virtex-II platform specification and supported development tools, this device is suited for engineers building demanding memory interfaces, signal-processing accelerators, and industrial embedded systems that require proven platform features and consistent vendor documentation.

Request a quote or submit an inquiry to receive pricing and availability for the XC2V8000-4FFG1152I.

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