XC2V80-5FG256I

The XC2V80-5FG256I is a Virtex®-II platform FPGA in a 256-ball fine-pitch BGA package, designed for mid-density programmable logic applications. It combines configurable logic, on-chip memory, and a flexible I/O complement to support memory interfaces, arithmetic processing, and system integration tasks.

This device targets applications that require a balance of logic density (approximately 80,000 system gates), embedded RAM, and a sizeable I/O count while meeting industrial operating temperature and RoHS compliance requirements.

Key Features

• Configurable Logic: 128 configurable logic blocks (CLBs) providing 1,152 logic elements to implement custom digital functions.
• On-chip Memory: 147,456 bits of embedded RAM (approximately 0.147 Mbits) for data buffering, FIFOs, and small on-chip storage.
• I/O Capacity: 120 user I/Os to support multiple peripheral interfaces and system-level connectivity.
• Logic Capacity (Gates): Equivalent to approximately 80,000 system gates for mid-range FPGA designs.
• Power Supply: Single-core voltage supply range of 1.425 V to 1.575 V for core operation.
• Package and Mounting: 256-ball BGA (256-FBGA, 17 × 17 mm) package, surface-mount for compact PCB integration.
• Industrial Temperature Rating: Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliant: Conforms to RoHS environmental requirements.
• Virtex-II Platform Capabilities: As part of the Virtex-II family, the platform includes features such as SelectRAM memory hierarchy, dedicated 18-bit × 18-bit multipliers, digital clock management (DCM) functionality, and advanced I/O capabilities (series-level features documented in the Virtex-II data sheet).

Typical Applications

• Memory Interface Controllers: Implement SDR/DDR and other DRAM/SRAM interface logic using the device’s I/O and embedded memory resources.
• Signal Processing and Arithmetic: Use the Virtex-II platform’s multiplier and logic resources for moderate DSP tasks and custom arithmetic accelerators.
• Embedded System Glue Logic: Consolidate control, bridging, and protocol conversion functions with the device’s configurable logic and I/O count.
• Prototyping and Evaluation: Prototype system-level IP and validate interfaces where mid-range logic density and on-chip RAM are required.

Unique Advantages

• Balanced Logic and Memory: 1,152 logic elements paired with 147,456 bits of on-chip RAM provide a practical mix for control logic, buffering, and small data stores.
• Substantial I/O Count: 120 user I/Os enable multiple peripheral and memory interface connections without external IO expanders.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in industrial and temperature-variable environments.
• Compact BGA Package: 256-ball FBGA (17 × 17 mm) minimizes board footprint while keeping routing manageable for medium-complexity designs.
• RoHS Compliance: Meets environmental regulatory expectations for lead-free assembly and products.
• Virtex-II Platform Ecosystem: Benefit from the platform-level feature set—SelectRAM architecture, dedicated multipliers, and clock management—documented for Virtex-II devices.

Why Choose XC2V80-5FG256I?

The XC2V80-5FG256I offers a practical combination of configurable logic, embedded RAM, and I/O density in a compact 256-FBGA package for mid-range FPGA applications. Its industrial temperature rating and RoHS compliance make it suitable for designs that must operate reliably across a wide temperature range while meeting environmental requirements.

This device is appropriate for engineers and procurement teams developing memory interfaces, DSP/accelerator blocks, system glue logic, or prototype platforms that require the documented Virtex-II platform capabilities together with clearly specified part-level resources and operating conditions.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the XC2V80-5FG256I.