XC3090-100PQ160C

IC FPGA 138 I/O 160QFP
Part Description

XC3000 Field Programmable Gate Array (FPGA) IC 138 64160 160-BQFP

Quantity 765 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package160-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case160-BQFPNumber of I/O138Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs320Number of Logic Elements/Cells320
Number of Gates6000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits64160

Overview of XC3090-100PQ160C – XC3000 Field Programmable Gate Array (FPGA) IC 138 64160 160-BQFP

The XC3090-100PQ160C is a commercial-grade FPGA in the XC3000 logic cell array family. It provides 320 logic elements and approximately 64 Kbits of on-chip RAM (64,160 bits) with 138 user-configurable I/Os, delivering a flexible platform for general logic replacement and sub-system integration.

Built for designers who need moderate gate density and configurable I/O, the device supports 4.75 V to 5.25 V supply operation and a commercial operating range of 0 °C to 85 °C, packaged in a 160-BQFP surface-mount form factor.

Key Features

  • Core Logic 320 logic elements (CLBs) and a gate-equivalent count of approximately 6,000 gates provide the building blocks for glue logic and mid-density integration.
  • Embedded Memory Approximately 64 Kbits of on-chip RAM (64,160 bits) for data buffering, state storage, and small lookup tables.
  • I/O Density & Flexibility 138 user-definable I/O pins support a wide range of custom interface needs for peripheral and subsystem connectivity.
  • Performance Series-level performance characteristics include guaranteed toggle rates in the 70–125 MHz range and logic delays on the order of 9 to 5.5 ns, suitable for many synchronous logic applications.
  • Power and Power-Down Designed with low quiescent and active power characteristics; includes an ultra-low current option in Power-Down mode and a documented power-down supply behavior (VCCPD = 2.30 V).
  • Output Drive Outputs rated for 4 mA source and sink drive capability, enabling direct interfacing with many TTL/CMOS-compatible loads.
  • Package & Mounting Surface-mount 160-BQFP package (supplier package: 160-PQFP, 28×28 mm) for compact board-level integration.
  • Commercial Grade & Operating Range Commercial grade device with an operating temperature range of 0 °C to 85 °C and recommended VCC of 4.75 V to 5.25 V for commercial operation.
  • Family-Level Compatibility XC3000 family features include 100% bitstream compatibility with the XC3100 family and ease of migration toward XC3300 HardWire devices for production scaling.

Typical Applications

  • General Logic Replacement Replace discrete logic or CPLD implementations with a reprogrammable FPGA to consolidate functions and reduce PCB component count.
  • Sub-system Integration Integrate multiple control or glue-logic functions into a single device to simplify board design and improve maintainability.
  • I/O-Intensive Interfaces Deploy where many user-definable I/Os are required for custom peripheral interfacing or protocol bridging.
  • Low-Power Standby Designs Use the device’s power-down option and low standby currents for applications that require minimal power when inactive.

Unique Advantages

  • Compact, mid-density logic 320 logic elements and ~6,000 gate capacity deliver the right balance of resources for medium-complexity designs without overprovisioning.
  • Generous I/O count 138 user-definable I/Os reduce the need for external multiplexing or I/O expanders, simplifying system-level routing and BOM.
  • Integrated RAM Approximately 64 Kbits of embedded memory supports buffering, small state machines, and lookup tables directly on-chip.
  • Power management options Low quiescent/active power characteristics plus an ultra-low current power-down mode help optimize energy use across duty cycles.
  • Production migration path Family-level bitstream compatibility and documented migration to mask-programmed XC3300 HardWire devices enable design scalability for higher-volume production.
  • Standard surface-mount packaging 160-BQFP (28×28 supplier PQFP) supports established PCB assembly flows and compact board layouts.

Why Choose XC3090-100PQ160C?

The XC3090-100PQ160C positions itself as a practical FPGA choice for designers needing a mid-density, commercially graded device with substantial I/O capability and on-chip RAM. Its combination of 320 logic elements, approximately 64 Kbits of embedded memory, and 138 I/Os makes it suitable for consolidating glue logic, integrating sub-systems, and implementing custom interfaces while operating on a 5 V supply.

Backed by the XC3000 family feature set — including power-down options, documented timing characteristics, and family-level bitstream compatibility — this device offers a reliable path from prototyping to production migration for projects that match its commercial-grade operating range and electrical requirements.

Request a quote or submit a parts inquiry to check availability, lead times, and pricing for the XC3090-100PQ160C.

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