XC3064L-8TQ144C
| Part Description |
XC3000A/L Field Programmable Gate Array (FPGA) IC 120 46064 144-LQFP |
|---|---|
| Quantity | 217 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 120 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 224 | Number of Logic Elements/Cells | 224 | ||
| Number of Gates | 4500 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46064 |
Overview of XC3064L-8TQ144C – XC3000A/L Field Programmable Gate Array (FPGA) IC, 120 I/O, 46,064-bit RAM, 144-LQFP
The XC3064L-8TQ144C is a field programmable gate array (FPGA) IC manufactured by AMD, implemented in a 144-lead LQFP package. It provides 224 logic elements, approximately 46,064 bits of embedded RAM, and 120 user I/O pins in a surface-mount form factor.
Designed for applications requiring on-chip programmable logic and moderate embedded memory, the device operates from a 3.0 V to 3.6 V supply and is rated for commercial temperature operation from 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Logic Capacity 224 logic elements for implementing custom combinational and sequential logic functions.
- Embedded Memory Approximately 46,064 bits of on-chip RAM to support local storage and buffering needs.
- I/O Density 120 user I/O pins to support interfacing and external signal connectivity.
- Gate Equivalent Approximately 4,500 gates of logic capacity referenced by the device data.
- Power Operates from a 3.0 V to 3.6 V supply range for low-voltage system designs.
- Package and Mounting 144-LQFP (supplier device package: 144-TQFP, 20×20) in a surface-mount package for compact PCB integration.
- Temperature Grade Commercial temperature range: 0 °C to 85 °C for general-purpose electronics applications.
- Environmental Compliance RoHS compliant to support regulatory requirements for lead-free assemblies.
Unique Advantages
- Balanced logic and memory 224 logic elements paired with approximately 46,064 bits of embedded RAM provide both logic density and local storage for moderate complexity designs.
- High I/O count 120 I/O pins enable flexible external interfacing options without immediately requiring additional I/O expansion components.
- Compact surface-mount package The 144-LQFP package (20×20) offers a compact footprint suited to space-constrained PCBs.
- Low-voltage operation 3.0 V to 3.6 V supply compatibility simplifies integration into modern low-voltage systems.
- Commercial-grade reliability Rated for 0 °C to 85 °C operation to match common commercial electronic environments.
- Regulatory readiness RoHS compliance supports lead-free assembly and environmental requirements.
Why Choose XC3064L-8TQ144C?
The XC3064L-8TQ144C positions itself as a compact, commercial-grade FPGA option that combines moderate logic capacity, on-chip RAM, and a high I/O count in a 144-LQFP surface-mount package. Its 3.0 V to 3.6 V supply range and RoHS compliance make it suitable for a wide range of general-purpose electronic designs requiring programmable logic and local memory.
Manufactured by AMD, this device is appropriate for designers and procurement teams seeking a verified FPGA solution with defined logic elements, embedded RAM capacity, and clear package and temperature specifications for integration into production hardware.
Request a quote or submit an inquiry to receive pricing and availability for the XC3064L-8TQ144C.

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Headquarters: Santa Clara, California, USA
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Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








