XC3090-100PQ208C

The XC3090-100PQ208C is a commercial-grade FPGA from the XC3000 logic cell array family designed for general logic replacement and sub-system integration. It combines a compact logic fabric with on-chip RAM and a high I/O count to address a range of commercial embedded designs.

Built on advanced CMOS static memory technology, the device emphasizes integration and predictable performance with a 5 V supply range and guaranteed logic toggle rates specified in the XC3000 series.

Key Features

• Core Logic — 320 logic elements delivering approximately 6,000 gates of user-configurable logic capacity for glue-logic, protocol bridging, and custom control functions.
• On-chip Memory — Approximately 0.064 Mbits (64,160 bits) of embedded RAM to support buffering, small lookup tables, and state storage within the FPGA fabric.
• I/O Density — Up to 144 user-definable I/Os to connect to multiple peripherals, buses, and system interfaces from a single device.
• Performance — XC3000-series guaranteed toggle rates of 70 to 125 MHz (logic delays roughly 9 to 5.5 ns), providing predictable timing characteristics for synchronous designs.
• Power and Power-Down Options — Operates from a 4.75 V to 5.25 V supply (commercial). Includes an ultra-low current option in Power-Down mode; XC3090 power-down supply current is specified at approximately 250 μA.
• Output Drive — 4 mA source and sink capability on outputs for standard-level interfacing.
• Package & Mounting — 208-BFQFP package (supplier package: 208-PQFP, 28 × 28 mm) in a surface-mount footprint suitable for compact PCB layouts.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance — RoHS compliant under the provided product data.

Typical Applications

• Subsystem Integration — Consolidate multiple logic functions into a single FPGA to reduce board-level component count and simplify connectivity.
• Glue Logic & Protocol Bridging — Implement custom interface translation, timing adjustment, and control logic between digital blocks.
• Prototyping and Development — Use as a development platform for validating logic designs and small-scale production runs where commercial-grade parts are appropriate.

Unique Advantages

• High I/O Count: 144 user-definable I/Os enable broad peripheral connectivity without external I/O expanders.
• Integrated Memory: On-chip RAM (64,160 bits) reduces the need for external SRAM for small buffering and state storage tasks.
• Predictable Timing: Series-specified toggle rates (70–125 MHz) and documented logic delays support deterministic timing analysis during place-and-route.
• Power-Down Efficiency: Ultra-low current Power-Down option and an XC3090 power-down current specification (~250 μA) help minimize standby power in commercial systems.
• Compact Surface-Mount Package: 208-pin PQFP footprint (28 × 28 mm) allows dense PCB integration while preserving signal routing options.
• Migration Path: XC3000-series bitstream compatibility and documented migration options in the family support evolution to other Xilinx device families for higher-volume or different performance needs.

Why Choose XC3090-100PQ208C?

The XC3090-100PQ208C positions itself as a reliable commercial FPGA option where a balance of logic capacity, I/O density, and on-chip memory is required. Its 320 logic elements, approximately 6,000 gates of logic, and 144 I/Os make it suitable for consolidating digital functions while keeping board complexity and BOM count down.

With a 5 V supply range, commercial temperature grading, RoHS compliance, and series-documented performance and power characteristics, this device is a pragmatic choice for commercial embedded designs that require predictable behavior and straightforward migration paths within the XC3000 family.

Request a quote or submit a sales inquiry to check pricing and availability for the XC3090-100PQ208C and to discuss how it fits your next commercial FPGA design.